The disclosure relates to a device for securing a first module and a second module in a space between a first mount and a second mount. The device comprises a biasing apparatus configured to urge the first module and the second module away from each other, thereby urging the first module against the first mount and urging the second module against the second mount. Further, the device comprises a release apparatus configured to move the first module and the second module toward each other, thereby moving the first module away from the first mount and moving the second module away from the second mount. The device provides an uncomplicated and flexible mounting and demounting of the first module and second module, thus attaining a flexible and uncomplicated attachment of each module to the respective mount and a flexible and uncomplicated detachment of each module from the respective mount.

Exemplary embodiments provide a database query processing system comprising a hybrid buffer pool stored in a computer main memory coupled to a processor, the hybrid buffer pool comprising: a shared buffer pool of page frames that contain dirty data pages that are modified and will be written back to storage; and an immutable buffer pool that temporarily contains read-only data pages from the storage, wherein the shared buffer pool is different from the immutable buffer pool. A page multiplexer that identifies which ones of the data pages from storage to store in the immutable buffer pool based at least in part on information from a query processor.

An example cooling system for a datacenter is disclosed. The datacenter includes a plurality of computers arranged in a row within a building. The row of computers separates a cold aisle and a hot aisle. The row of computers defines an air passageway between the cold aisle and the hot aisle. The row of computers is associated with a top surface that is below and spaced apart from an overhead surface of the building to define a gap between the top surface and the overhead surface. The example cooling system includes an inflatable air duct to be disposed within the gap. The inflatable air duct has selectively an inflated state and a deflated state. The inflatable air duct filling more of the gap when the inflatable air duct is in the inflated state than when the inflatable air duct is in the deflated state.

An air directing device includes a rack-coupling portion that couples the air directing device with a rack, and one or more air directing portions. The air directing portions include one or more openings and one or more scoops that direct air from outside the rack into at least one of the openings when the air directing device is coupled to the rack.

The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.

A system includes a slot-mountable rack mount module. The slot-mountable rack mount module is shaped and sized to be mountable into a given rack mount slot of an electronics rack mount. The electronics rack mount has multiple rack mount slots including the given rack mount slot. The slot-mountable rack mount module includes: a vessel containing at least one material. The at least one material is configured to absorb heat from within the electronics rack mount based at least on at least one of (a) at least one phase change of at least one of the at least one material or (b) at least one endothermic reaction of one or more of the at least one material.