Provided are a fan control method and a fan control system. The fan control method of the present invention includes the steps of predetermining a reliable operating temperature of a hard disk; creating a storing a corresponding relationship between an average hard disk temperature and a fan speed, and creating and storing a corresponding relationship between a hard disk temperature greater than the reliable operating temperature and a fan speed; reading actual temperatures of the plurality of hard disks; comparing the actual temperatures of the plurality of hard disks with the reliable operating temperature; computing an average temperature of the plurality of hard disks; and outputting a control signal to adjust the fan speed based on the stored corresponding relationship between an average hard disk temperature and a fan speed. Accordingly, the present invention may increase hard disk reliability and decrease power dissipation of a fan and system noise.

A data center rack includes a housing, at least one wireless access point (AP) mounted within the housing and wirelessly connectable to a network switch external to the housing, and at least one tray including a plurality of mobile device power connections to provide power to a plurality of mobile devices.

A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.

A data processing equipment structure includes a plurality of vertical and horizontal frame components, which, together, define an equipment structure frame, and a plurality of panels disposed relative to the equipment structure frame to define a periphery. At least one of the plurality of vertical and horizontal frame components is an extruded strut having a generally uniform cross-section. The extruded strut includes an outwardly-facing channel extending along each of a pair of opposing sides of the extruded strut, at least one of which includes a set of evenly-spaced ridges, extending along each of two sides of the channel, for accommodating a threaded fastener. The extruded strut further includes one or more ledges, each having a depth sufficient to accommodate a thickness of one of the plurality of panels.

In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell.

A computing device caddy for housing a computing device is provided. The caddy includes a first caddy component. The first caddy component includes a first end wall including a first plurality of fins coupled to an outer surface of the first end wall. The first plurality of fins are configured relative to each other to create eddies within a flow. The caddy also includes a second caddy component. The second caddy component includes a second end wall. The second end wall is opposite the first end wall. The second caddy component is coupled to the first caddy component, thereby defining a cavity for housing the computing device.

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.

A server includes a case and function modules. The case includes a frame, a first upright partition and a second upright partition. The frame has an internal space and an opening. The opening corresponds to the internal space. The first upright partition and the second upright partition jointly define a first accommodating portion, a second accommodating portion and a third accommodating portion in the internal space. Each of the function modules is a first function module, a second function module or a third function module. A width of the first function module is half of the width of the second accommodating portion. The width of the first function module, a width of the second function module and a width of the third function module have a ratio of 1:2:4.