An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

A method and system of managing power within a data center and providing power to the load including IT equipment includes determining a required power level for a data center, and determining a level of renewable energy available from one or more renewable energy sources. The method also includes determining a level of power available within a primary storage system for the data center. In addition, the method includes selectively utilizing renewable energy from the renewable energy sources to charge the primary storage system or power server racks, a cooling system, or a lighting system.

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

A multiple mode cooling system circulates outside air through a data center to cool heat-generating information technology (IT) component(s). Based on outside and interior air temperature values and outside humidity value, a controller determines that outside air cooling poses a risk of damage to the heat-generating IT component(s) due to condensation or overheating. Controller also determines that compressor(s) of the cooling system have been inactive for less than a minimum off-time specified for maintaining service life of the compressor(s). In response, controller checks a cooling mode setting and, based on determining that a cooling mode setting indicates an optimization preference for avoiding the posed risk of damage to the heat-generating IT component(s) over compressor service life, the controller restarts the compressor(s) before expiration of the minimum off-time.

An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

A deployable assembly can be positioned within a building for a datacenter or other environment. An upper frame can be released from the deployable assembly and lifted to allow lower ends of the upper frame to be coupled with upper ends of columns that also form part of the deployable assembly. The deployable assembly can be laterally expanded to extend horizontal members, such as in the upper frame and/or in a core chassis that may further form part of the deployable assembly. The lateral expansion can reach a size suitable for a cold aisle corridor, for example. The core chassis can be raised into a raised position within the upper frame, for example, such that trays within the core chassis are suitably positioned for receiving cabling from computing components to be arranged along the cold aisle corridor.

Technologies for dynamically managing resources in disaggregated accelerators include an accelerator. The accelerator includes acceleration circuitry with multiple logic portions, each capable of executing a different workload. Additionally, the accelerator includes communication circuitry to receive a workload to be executed by a logic portion of the accelerator and a dynamic resource allocation logic unit to identify a resource utilization threshold associated with one or more shared resources of the accelerator to be used by a logic portion in the execution of the workload, limit, as a function of the resource utilization threshold, the utilization of the one or more shared resources by the logic portion as the logic portion executes the workload, and subsequently adjust the resource utilization threshold as the workload is executed. Other embodiments are also described and claimed.

A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

A device such as an add-in card 100 for a computer system includes a circuit board assembly (110) and a cover (120). The cover (120) has two sides and a top extending between the sides. The sides contact a major surface of the circuit board assembly (110) adjacent to and along opposite edges. The cover (120) may protect electronic components of the circuit board assembly (110) and control air flows, flatness, and rigidity of a device. The cover (120) may further be sized and shaped to limit movement of electronic components of the circuit board assembly (110).

A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.