A control apparatus for operating an electric drive for a vehicle may include one or more of the following: a plurality of power module, which has one or more power semiconductors; an intermediate circuit capacitor, which is connected in parallel to the power module; a cooler for dissipating heat generated by the power module; an interconnect device for obtaining electrical contact to the power module, where the interconnect device has a first section and a second section at an angle to the first section, and where the first section and the second section are each perpendicular to a main plane of the power module.

An electronic assembly includes a PCB coupled to a mounting surface of a cooling jacket circumferentially mounted on a motor and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on a first surface of the PCB proximate to the motor. The TMA includes the cooling jacket, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.

A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.

A wireless device charger is configured to produce an alternating magnetic field, thereby inducing an alternating electrical current within a capture coil of a personal electronic device proximate to the wireless device charger. The wireless device charger includes a source coil having a ferrite element configured to generate the alternating magnetic field, a housing formed of a thermally conductive material in thermal communication with the ferrite element, and an air movement device configured to produce a turbulent air flow across a surface of the housing flowing from an air inlet to an air outlet, thereby reducing a housing temperature.

A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first and second side surfaces have maximum lengths along a longitudinal direction which are greater than maximum lengths of the first and second end surfaces along a lateral direction. The SOM circuit board further includes a plurality of computing components, each of the plurality of computing components mounted on one of the first face surface or the second face surface. The SOM circuit board further includes an input/output connector mounted on the second face surface. The SOM circuit board further includes a plurality of mounting holes extending along the transverse direction through and between the first face surface and the second face surface.

A cabinet enclosure for mounting to a vehicle and providing an inner cavity isolated from a surrounding environment. The cabinet enclosure includes a removable module including a frame and a plurality of mounts on the frame for receiving an electrical component. A housing defines the inner cavity and includes a plurality of predefined mounting locations within the inner cavity configured to receive the removable module. The housing is configured to protect the inner cavity from exposure to moisture, heat, vibration and/or electromagnetic forces. An interface element secures the housing to a vehicle.

A traction inverter system includes a capacitor module, a power module, a cold plate between and in contact with the modules, and an end plate defining an inlet and outlet. The modules and plates define a bore spanning the modules and plates, and a passageway in fluid communication with the inlet and outlet. The traction inverter system also includes a mechanical fastener occupying the bore, spanning the modules and plates, and clamping the modules and plates together.

Techniques related to powertrain architectures for vehicles (such as hybrid electric vehicle/electric vehicles) utilizing an on-board charger are disclosed. The techniques include a device for power regulation, the device comprising a direct current (DC)-to-DC voltage converter configurable to convert a first DC voltage from an alternating current (AC)-to-DC converter to generate a first converted DC voltage to charge a battery, and convert a second DC voltage from the battery to a second converted DC voltage for a DC-to-AC inverter. The inverter couples to a motor. A control circuit is configured to direct an operating mode of the voltage converter.

A control unit (SG) is provided for evaluating signals for a vehicle (FZ), including at least two printed circuit plates (PB, CB) equipped with modules to be cooled, which are positioned opposite one another and are covered by cooling structures (KS1, KS2) on the opposed sides. Sidewalls (SW) are arranged at a right angle with respect to the cooling structures (KS1, KS2) and, together with the cooling structures, form a cooling duct. A fluid is movable through the cooling duct for heat dissipation. Seal(s) are provided between the sidewalls and the cooling structures.

A digital processing device with high input/output connectivity and modular architecture comprises a first plurality of input ports, a second plurality of output ports, and a third plurality of at least four basic elementary modules. The third plurality of the elementary modules is split up according to a partitioning of at least two sub-assemblies of module(s), at least two of which form different islets comprising at least two modules. The digital processing device comprises a harness of optical links for mutually interconnecting the sub-assemblies of modules whose interconnection lengths are compatible with interconnection runs between two interconnected islets which make it possible to avoid, by sidestepping, one or more items of equipment external to the digital processing device, and which are installed on a space platform and interposed between the two interconnected islets, or which make it possible to distribute at least two interconnected islets over two heat exchange zones of the space platform that are far separated by a separation distance on the scale of the size of the platform.