Patent classifications
H05K7/20845
Electronic control device including a thermal mass element
An electronic control device includes a relay including a relay case and an electromagnet and a contact part. The relay case is structured to contain the electromagnet and the contact part. The contact part is structured to be opened and closed by action of the electromagnet. A connector terminal is electrically connected to the relay. A circuit board is structured to mount the relay and the connector terminal thereon. An exterior shell is structured to contain the circuit board such that the connector terminal is exposed outside the exterior shell. A thermal mass element is disposed in a wiring route between the relay and the connector terminal.
Multiple Inlet Vehicle Air Filtration System
An air box and methods are provided for communicating an airstream through an air filter to an air intake duct of an internal combustion engine of a vehicle. The air box is comprised of a housing that supports the air filter within an interior of the housing. A mount portion within the housing fixedly receives a base of the air filter. Multiple air inlets couple with corresponding air inlet ports of the vehicle to direct the airstream into the air box. A duct directs the airstream from the multiple air inlets to the interior of the housing and to the air filter. An opening into the housing exposes at least one surface of an electronic control unit (ECU) to the airstream for cooling of the ECU. A conduit communicates the airstream from an interior of the air filter to the air intake duct of the internal combustion engine.
SYSTEM FOR COOLING STORAGE DEVICE AND SMART VEHICLE INCLUDING THE SAME
A cooling system for efficiently cooling large-scale data storage devices embedded in a vehicle, and a smart vehicle including the same are disclosed. The storage device cooling system includes a storage housing section located at a ceiling-mounted structure of a vehicle, provided with an indoor space thereof in which a plurality of storage devices is kept and an opening/closing device configured to open or close the indoor space, a sensing circuit configured to detect a temperature of the indoor space, and an opening/closing controller configured to control operations of the opening/closing device in response to the temperature detected by the sensing circuit.
Power Semiconductor Device and Power Conversion Device
A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.
THERMAL INTERFACE ASSEMBLY
A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.
Electronic Control Device
An electronic control device includes a relay including a relay case and an electromagnet and a contact part. The relay case is structured to contain the electromagnet and the contact part. The contact part is structured to be opened and closed by action of the electromagnet. A connector terminal is electrically connected to the relay. A circuit board is structured to mount the relay and the connector terminal thereon. An exterior shell is structured to contain the circuit board such that the connector terminal is exposed outside the exterior shell. A thermal mass element is disposed in a wiring route between the relay and the connector terminal.
Cooling conduit for electrical components on a PCB
An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.
Power semiconductor device and power conversion device
A power semiconductor device includes a first power semiconductor element, a second power semiconductor element, a first conductor plate, a second conductor plate, a third conductor plate, and a fourth conductor plate. The power semiconductor device also includes a DC positive terminal, a DC negative terminal, an AC terminal, and a sealing member that integrally seals the first conductor plate, the second conductor plate, the third conductor plate, and the fourth conductor plate. Each of the DC positive terminal, the DC negative terminal, and the AC terminal has a cut section formed by cutting a tie bar that integrally couples the DC positive terminal, the DC negative terminal, and the AC terminal.
VENTED SENSOR POD SYSTEMS AND METHODS
A method of regulating a temperature of a sensor pod on an autonomous vehicle includes determining a temperature of the sensor pod, determining an amount a vent should be opened based upon the operational status of the autonomous vehicle, an internal temperature of the sensor pod, and ambient temperature of the environment, opening a vent when the temperature is above a predetermined threshold temperature, and closing the vent when the temperature is below the predetermined threshold temperature.
COOLING CONDUIT FOR ELECTRICAL COMPONENTS ON A PCB
An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.