A semiconductor module including a semiconductor element, a controller, a cooler, and a temperature sensor are included. The controller is connected to the semiconductor module and controls switching operation of the semiconductor element. The temperature sensor measures a coolant temperature, which is a temperature of the coolant. The controller controls turn-off speed of the semiconductor element based on the coolant temperature. The controller increases the turn-off speed as the coolant temperature rises.

A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.

The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

An object of the invention is to provide a power conversion device which secures insulation and is miniaturized still more without being affected by electromagnetic noises. A power conversion device according to the invention includes a power semiconductor module which converts a DC current into an AC current and includes a DC positive terminal and a DC negative terminal, and a resin cover portion which includes an insulating portion disposed between the DC positive terminal and the DC negative terminal. The cover portion holds a metal member which covers the DC positive terminal and the DC negative terminal.

Modular inverter platforms and methods for providing physical and electrical configurability and scalability are disclosed. The modular inverter apparatus includes a printed circuit board (PCB) comprising at least two modules and one or more mounting components structured to switch the at least two modules between a plurality of physical configurations. The modular inverter apparatus also includes a plurality of electrical interconnections structured to electrically connect the at least two modules and to switch the at least two modules between a plurality of electrical configurations.

A power conversion device includes an electronic component, a cooler, a housing, protruding pipes, and annular seal members. Each of the seal members includes a seal body portion interposed between a corresponding one of the protruding pipes and the housing, and a flange portion extending outward from the seal body portion in a radial direction and contacting an outer surface of the housing from an axial direction. The housing includes a peripheral wall surface formed to surround the flange portion from an outer peripheral side, and an annular groove portion formed along an outer peripheral edge of the flange portion inside the peripheral wall surface. The peripheral wall surface is formed to extend outward, in the axial direction, from an axial contact surface of the housing contacted by the flange portion.

An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

A module having a power semiconductor device and a ceramic capacitor which is configured for cooling the power semiconductor device.

A semiconductor device module may include a leadframe spacer that provides the functions of both a leadframe and a spacer, while enabling a double-sided cooling configuration. Such a leadframe spacer may include a leadframe surface that provides a die attach pad (DAP) that is shared by at least two semiconductor devices. The leadframe spacer may include at least one downset, where the semiconductor devices may be attached within a recess defined by the at least one downset. A first substrate may be connected to a first side of the leadframe. A second substrate may be connected to downset surfaces of the at least one downset, and positioned for further connection to the semiconductor devices in a double-sided assembly.