An electronic device may have transparent housing structures such as walls formed of glass or sapphire. Housing structures such as transparent housing structures may have a colored coating. The colored coating may include an absorptive layer and a metal layer. The coating may exhibit a color that can be adjusted by adjusting the thickness of the thin absorptive layer. A colored layer such as a layer of colored polymer may be incorporated into the colored coating to further adjust the color of the coating. The colored coating may be formed on an inner or outer housing structure surface. The surface may have a texture to provide the coating with a matte appearance. When formed on an outer surface, a diamond-like carbon layer may protect the colored coating. When formed on an inner surface, a passivation layer may be used to prevent oxidation of the metal layer.

A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.

An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).

A circuit board for a control device for a vehicle includes a clamp edge for clamping on a cover for covering circuit board, the clamp edge being formed by an electrically conductive layer that is situated on an upper side of the circuit board. The circuit board has a plurality of solder bumps for shielding an electromagnetic radiation, the solder bumps being arranged in a row in clamp edge, and each of solder bumps being insulated from the electrically conductive layer by a ring of solder resist.

A shielding cage with an improved construction is disclosed that permits such cages to be more closely spaced together when a plurality of them are arranged in side-by-side arrays of cages. The cage is formed from a sheet metal blank that is stamped and formed to define sidewalls, top wall, bottom wall and a rear wall. In one embodiment, the ends of the blank are formed with interengaging elements in the form of tabs and slots that interfit within the plane of one of the cage walls, thereby eliminating the need for projections disposed on the sidewalls of the cage.

An electronic device may have transparent housing structures such as walls formed of glass or sapphire. Housing structures such as transparent housing structures may have a colored coating. The colored coating may include an absorptive layer and a metal layer. The coating may exhibit a color that can be adjusted by adjusting the thickness of the thin absorptive layer. A colored layer such as a layer of colored polymer may be incorporated into the colored coating to further adjust the color of the coating. The colored coating may be formed on an inner or outer housing structure surface. The surface may have a texture to provide the coating with a matte appearance. When formed on an outer surface, a diamond-like carbon layer may protect the colored coating. When formed on an inner surface, a passivation layer may be used to prevent oxidation of the metal layer.

An electronic device is provided. The electronic device includes a circuit board, a connector, a shielding frame and a shielding cover. The connector is disposed on the circuit board. The shielding frame is disposed on the circuit board, wherein the connector is disposed in the shielding frame. The shielding cover is detachably connected to the shielding frame, wherein when the shielding cover is combined with the shielding frame, an inlet is formed between the shielding frame and the shielding cover, and the shielding frame and the shielding cover are adapted to block an interference signal.

An information handling system to wirelessly transmit and receive data may include a base chassis including a metal C-cover and metal D-cover to house a processor, a memory, and a wireless adapter, the metal C-cover to house a speaker grill, the speaker grill covering a speaker to emit audio waves; the speaker grill formed within the C-cover to emit a target radio frequency (RF) including a slot formed around a portion of the speaker grill forming a peninsula on the speaker grill that is physically separated from the C-cover; an antenna element placed behind the speaker grill and operatively coupled to the wireless adapter; an electromagnetic interference (EMI) shield forming a cavity enclosing the speaker and the antenna element, including a plurality of metallic shielding walls extending from the C-cover to a D-cover of the information handling system; and a conductive rubber gasket placed between the plurality of conductive walls and the D-cover to shield the cavity from EMI sources.

A method according to one embodiment includes securing a first plurality of conductive sheets to a surface, applying a conductive tape to a first plurality of joints between conductive sheets of the first plurality of conductive sheets, and securing a second plurality of conductive sheets to the first plurality of conductive sheets without fully penetrating the first plurality of conductive sheets. In such an embodiment, each of a second plurality of joints between conductive sheets of the second plurality of conductive sheets is offset relative to the first plurality of joints.

A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.