A sealing arrangement includes: a first machine element and a second machine element, each made of an electrically-conductive material; and a seal. The first and second machine elements are sealed against one another by the seal. At least one of the machine elements is made of an electrically-conductive plastic which is at least partially covered by an electrically-insulating, injection-molded skin as a result of production. The seal has an electrically-conductive support body. The support body has at least one substantially mandrel-shaped projection comprising an electrically-conductive material which is arranged on a side of the support body facing the injection-molded skin and completely penetrates the injection-molded skin.

A circuit board assembly for association with an aircraft includes a circuit board and an electromagnetic interference component connected to the circuit board. The circuit board assembly may further include an enclosure having an electromagnetic signal permissive layer and an electromagnetic signal blocking layer. The electromagnetic signal permissive layer may include a housing that define a volume. The housing may enclose the electromagnetic interference component on the circuit board. The electromagnetic signal blocking layer defines a conductive barrier about the electromagnetic interference component.

An information handling system to wirelessly transmit and receive data may include a base chassis including a metal C-cover and metal D-cover to house a processor, a memory, and a wireless adapter, the metal C-cover to house a speaker grill, the speaker grill covering a speaker to emit audio waves; the speaker grill formed within the C-cover to emit a target radio frequency (RF) including a slot formed around a portion of the speaker grill forming a peninsula on the speaker grill that is physically separated from the C-cover; an antenna element placed behind the speaker grill and operatively coupled to the wireless adapter; an electromagnetic interference (EMI) shield forming a cavity enclosing the speaker and the antenna element, including a plurality of metallic shielding walls extending from the C-cover to a D-cover of the information handling system; and a conductive rubber gasket placed between the plurality of conductive walls and the D-cover to shield the cavity from EMI sources.

A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.

The disclosed apparatus may include (1) a split heatsink assembly that comprises (A) a first heatsink that includes a base for thermally coupling to a first heat-emitting component, wherein the base of the first heatsink forms an opening, and (B) a second heatsink that includes a pedestal for thermally coupling to a second heat-emitting component, wherein the pedestal of the second heatsink fits into the opening formed by the base of the first heatsink, and (2) an EMI absorber that at least partially encompasses the pedestal of the second heatsink and resides between the pedestal of the second heatsink and the base of the first heatsink in the opening. Various other apparatuses, systems, and methods are also disclosed.

An electronic device which includes a cover, a base coupled to the cover to create an enclosure, a conductive layer positioned between the cover and the base and arranged to reduce radiation from entering the enclosure, and a gasket positioned between the cover and the base to create a seal and positioned between the conductive layer and the enclosure.

Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.

The present disclosure relates to an enclosure comprising a body, a lid, a locking member, and a resilient element arranged between the body and the lid. The resilient member is arranged to exert a resistive force on the lid when pressed between the body and the lid to seal the enclosure in a sealed position. The body includes at least a first recess and the lid includes at least a second recess, where each pair of a first recess and second recess is arranged to align in the sealed position, and to form a corresponding channel when aligned against the resistive force such that the enclosure is in the sealed position, and to then receive a corresponding locking member in the channel.

An exemplary faraday bag with magnetic closure system includes an actuatable closure section defined between a shielding compartment and an access mouth. The closure section preferably includes a retention segment, a distal flap segment, and an intermediate flap segment therebetween. Base magnets are disposed within the retention segment and a first panel of the bag. Flap magnets are disposed within the distal flap segment and a second panel of the bag. When the closure section is in open configuration, the flap magnets are substantially out of attractive magnetic engagement with respective base magnets, and the shielding compartment is accessible from an ambient environment through the access mouth. When the closure section is in closed configuration, the flap and retention segments are folded with respect to one another, the flap magnets are in attractive magnetic engagement with respective base magnets, and the access mouth is thereby retained in an RF-sealed configuration.

An electronic apparatus includes a housing having conductivity, an electronic component includes an outer shell having conductivity, and an electrically conductive elastic member. The electrically conductive elastic member has conductivity and elasticity and is disposed between the outer shell of the electronic component and a predetermined inner surface of the housing. A pair of ribs stand on the predetermined inner surface. The electrically conductive elastic member is disposed between the pair of the ribs. The ribs have facing side surfaces facing each other, each of the facing side surfaces has an inclined surface in such a way that each of the facing side surfaces and the predetermined inner surface is in continuous contact with a corresponding part of an outer surface of the electrically conductive elastic member that is compressed, each of the facing side surfaces and the predetermined inner surface facing the corresponding part of the outer surface.