A connector assembly may be formed to include a cage, with a connector positioned inside the cage, and an air scooping structure on a side wall of the cage. The air scooping structure is configured to divert a portion of the air flowing along the outside of the cage and re-direct it inward to as to pass by a surface of an inserted module and direct generated thermal energy away from the module. A separate air scooping structure may be formed on each side wall and may include a plurality of individual air scoops disposed in a defined pattern and located in close proximity to any thermal energy-generating areas of the inserted module. A side wall offset may be included along each cage side wall in the area of the included connector to form a wider gap between the connector housing and the cage side wall.

A housing device for isolating electromagnetic interference emitting devices includes a structural frame for housing the electromagnetic interference emitting devices. The housing device further includes a non-structural electromagnetic interference isolating enclosure. The non-structural electromagnetic interference isolating enclosure is for encapsulating the structural frame. The non-structural electromagnetic interference isolating enclosure includes an access portion that enables the structural frame to be accessed. The access portion includes a vent.

The cooling system includes a series of cooling channels arranged to provide convective cooling, with inserts for shielding electromagnetic interference (EMI) that is propagated by the waveguide nature of the cooling channels. Due to the relatively open nature, the cooling channels can serve to propagate EMI energy. The inserts mitigate the EMI exiting via these channels by attenuating or blocking the EMI. The inserts are shaped to block particular frequencies of EMI. The inserts may include thin sheet metal contoured to a half-wave profile, arranged along each cooling channel.

A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated and an optical state detector. The optical state detector obtains electromagnetic radiation from the internal volume while the internal volume is EMI isolated and makes a determination that a device disposed in the internal volume has an optical state associated with the electromagnetic radiation.

A system for providing electromagnetic interference (EMI) suppression for data processing devices includes a frame adapted to receive a data processing device of the data processing devices. The system further includes the data processing device that includes a payload module adapted to suppress EMI from an internal volume to an ambient environment by greater than 80 decibels. The data processing device further includes the internal volume adapted to house EMI emitting devices that generate EMI.

A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated. The data processing device further includes an electromagnetic radiation (EMR) suppressing vent that defines one wall of the internal volume. The data processing device further includes a wireless system. The wireless system includes a first portion that is disposed in the internal volume. The first portion receives network data units from EMI emitting devices disposed in the internal volume and a second portion of the wireless system. The second portion is disposed outside of the internal volume and obtains the network data units from the first portion using a wireless connection that utilizes a transmission path that traverses through the EMR suppressing vent.

A data processing device includes an internal volume for housing devices and an isolation test system. The isolation test system makes a determination that an electromagnetic interference suppression state of the data processing device is to be determined; in response to the determination: suppresses generation of electromagnetic radiation by the devices; while the generation of the electromagnetic radiation by the devices is suppressed: identifies a quantity of second electromagnetic radiation that propagated through a boundary of the internal volume; makes a second determination, based at least in part on the quantity, that the electromagnetic interference suppression state of the data processing device is an electromagnetic interference suppression compromised state; and initiates performance of an action set to remediate the electromagnetic interference suppression compromised state of the data processing device based on the second determination.

A data processing device includes an internal volume for housing electromagnetic interference emitting devices. The data processing device further includes a first electromagnetic radiation absorbing vent. The data processing device further includes a second electromagnetic radiation absorbing vent. The first electromagnetic radiation absorbing vent and the second electromagnetic radiation absorbing vent delineate a gas flow path through the internal volume.

The cooling system includes a series of cooling channels arranged to provide convective cooling, with inserts for shielding electromagnetic interference (EMI) that is propagated by the waveguide nature of the cooling channels. Due to the relatively open nature, the cooling channels can serve to propagate EMI energy. The inserts mitigate the EMI exiting via these channels by attenuating or blocking the EMI. The inserts are shaped to block particular frequencies of EMI. The inserts may include thin sheet metal contoured to a half-wave profile, arranged along each cooling channel.

An electronic device housing of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate, and metal side plates folded and integrally connected to the bottom plate, in which, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member, and the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M).