Patent classifications
H05K9/0045
POLYMER-GRAPHENE ELECTRONIC COMPONENT HOUSING
An electronic component housing defining an EMI shield and an ESD protection cover includes a polymeric core formed from a first polymeric material with a reinforcement material and an overmolded outer layer formed from a second polymeric material with between about 2 wt. % and about 30 wt. % graphene. The reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, the overmolded outer layer defines a housing skin disposed on the polymeric core.
CIRCUIT MODULE
A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.
Thermal Management and/or EMI Mitigation Materials Including Coated Fillers
Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.
Structure for shielding electronomagnetic waves
A structure and a device may include an electromagnetic wave generator configured to generate electromagnetic waves; a shielding structure configured to surround at least a portion of the electromagnetic wave generator; and a metal layer provided on inner surfaces of upper and side portions of the shielding structure, wherein the metal layer having a predetermined surface roughness.
Data transmission blocking holder for personal data transmitting and receiving devices
A personal communication device (“PCD”) holder includes: an at least semi-rigid housing having a base wall and at least one side wall extending from the base wall so as to form a housing into which a user can place a PCD, the base wall and the at least one side wall including a conductive material so that the base wall and the at least one side wall bock are data signal blocking; and a lid configured to be moveable with respect to the housing so as to enable the user to (i) place the PCD into the housing and (ii) securely and releasably close the lid onto the housing, the lid also including a conductive material so that when the lid is closed onto the housing, the holder is data signal blocking, preventing a data signal from reaching the PCD.
CRADLE WITH PRIVACY PROTECTION FUNCTION FOR PORTABLE ELECTRONIC DEVICE
A front on an extension line of a built-in front camera lens part of said portable electronic device during use of the cradle is shielded by an opaque or translucent lens shielding member provided on the front face side of the cradle 3 for portable electronic devices of the present invention, thereby disabling photography of front surrounding conditions of the cradle, even if an operation of front camera unwanted by an owner is performed, and a microphone hole of the electronic device 11 is shielded by providing a microphone hole shielding member 13 in a space between the charging stand 4 and a housing of the electronic device 11 mounted thereon, and therefore it becomes possible to reduce a risk of an outflow of ambient voice information of the cradle, even if an operation of microphone unwanted by an owner is performed.
Electromagnetic interference suppressing shield
An electromagnetic interference (EMI) suppressing shield is disclosed. The EMI suppressing shield can include a plurality of shield portions electrically coupled to a positive electric potential polarity or a negative electric potential polarity. At least some of the plurality of shield portions can be electrically isolated from one another. At least one of the plurality of shield portions can be electrically coupled to the positive electric potential and at least one of the plurality of shield portions can be electrically coupled to the negative electric potential.
Fused T-splice wiring
A power distributor including a first conductive coupling device electrically coupled to a bare-wire non-terminating section of a first conduit. A second conductive coupling device is electrically coupled to a terminating end of a second conduit. The first conduit is a larger gauge than the second conduit. A fuse electrically connects the first conductive coupling device and the second conductive coupling device. A housing encases the first and second conductive coupling devices and the fuse.
METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.
Multi-functional front slice panel apparatus and method of manufacture
A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.