A method of manufacturing an electronic component includes temporarily fixing an electronic component body to a support with a temporary fixation material having an area smaller than that of the electronic component body interposed therebetween, disposing a shield resin layer having an area larger than that of an upper surface of the electronic component body on the upper surface of the electronic component body, and applying pressure to the shield resin layer via an elastic layer and causing the shield resin layer to adhere such that the shield resin layer extends from the upper surface that is the surface of the electronic component body opposite to the temporary fixation material to a bottom surface that is a surface of the electronic component body that faces the temporary fixation material via side surfaces of the electronic component body.

An example control component for controlling an engine component includes a housing. The housing defines a cavity configured to receive control circuitry configured to control the engine. The housing includes an exterior layer defining an exterior surface of the housing and an interior polymeric layer defining an interior surface of the housing. The interior polymeric layer is adjacent to and substantially coextensive with the exterior layer. The interior polymeric layer includes an electrically and thermally conductive material. An example technique includes forming the exterior layer and forming the interior polymeric layer.

Example embodiments described in this disclosure are generally directed to a plastic enclosure that provides EMI shielding and heat sinking to an electronic assembly. In one embodiment, the enclosure includes a housing portion formed of a base material that includes a polymer containing graphene nanostructures and carbon nanostructures. The graphene nanostructures provide a thermal conductivity characteristic to the base material. A set of standoff elements made of the base material is provided inside the housing for mounting the electronic assembly. Heat generated by the electronic assembly is conducted out of the enclosure by the standoff elements due to the graphene nanostructures. The carbon nanostructures provide an electrical conductivity characteristic to the base material. A lid formed of the base material may be attached to the housing portion. The carbon nanostructures in the housing portion and the lid provide EMI shielding to the electronic assembly inside the enclosure.

An electronic module that comprises a housing that receives at least one electronic component is disclosed. The housing contains a polymer composition that includes an electromagnetic interference filler distributed within a polymer matrix, wherein the electromagnetic interference filler includes a plurality of carbon fibers and the polymer matrix contains a thermoplastic polymer. Further, the composition exhibits an electromagnetic interference shielding effectiveness of about 30 decibels or more, as determined in accordance with ASTM D4935-18 at a frequency of 5 GHz and thickness of 1 millimeter, and an in-plane thermal conductivity of about 1 W/m-K or more, as determined in accordance with ASTM E 1461-13.

An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 μm for electromagnetic signals having frequencies in a kilohertz range.

A housing component for a mobile terminal such as a smartphone or a laptop computer, includes a carbon fiber reinforced plastic body that is operative to shield components within the housing from electromagnetic radiation. The housing component further includes at least one antenna window. The at least one antenna window is configured to be associated with at least one antenna of the terminal. The at least one antenna window enables the at least one antenna to transmit and receive electromagnetic signals without being shielded or interfering with the operation of the terminal circuitry within the housing.

An automation field device comprises a housing that surrounds an inner space; a sensor- and/or actuator element arranged at the housing; an electronic circuit arranged in the housing and having a round, outer contour and a plurality of spring contacts in an edge region. The inner contour of the housing and the edge contour of the first circuit board are adapted to one another so that the first circuit board is introducible into the housing with a main plane orthogonal to a longitudinal axis of the housing. The spring contacts are so arranged on the first circuit board and embodied to hold the first circuit board in the inner space and to produce an electrical connection between the first circuit board and the housing to drain away disturbance currents from the first circuit board.

Example embodiments described in this disclosure are generally directed to a plastic enclosure that provides EMI shielding and heat sinking to an electronic assembly. In one embodiment, the enclosure includes a housing portion formed of a base material that includes a polymer containing graphene nanostructures and carbon nanostructures. The graphene nanostructures provide a thermal conductivity characteristic to the base material. A set of standoff elements made of the base material is provided inside the housing for mounting the electronic assembly. Heat generated by the electronic assembly is conducted out of the enclosure by the standoff elements due to the graphene nanostructures. The carbon nanostructures provide an electrical conductivity characteristic to the base material. A lid formed of the base material may be attached to the housing portion. The carbon nanostructures in the housing portion and the lid provide EMI shielding to the electronic assembly inside the enclosure.

A housing includes a cup-shaped, plastic housing case; a cooling channel guided in the housing case for fluid cooling of an electric or electronic device situated in an interior of the housing case; and a planar shielding body integrated into the housing case and traversing walls of the housing case for shielding from electromagnetic radiation. The shielding body is a metallic wire cage or trough. The cooling channel is a metallic tubing. The shielding body and the cooling channel are connected to form a frame-like, pre-assembled assembly. The pre-assembled assembly, consisting of the shielding body and the cooling channel, is extrusion-coated with a plastic or encapsulated in a plastic to form the housing case.

A housing is provided for an output stage with power semiconductors of a modular converter. The housing includes a stretchable hood arranged on the base plate. The housing further includes a metallic lattice formed in or on the hood and forming a Faraday cage, wherein the hood is configured to be stretchable so as to enlarge the volume enclosed by the hood in the event of an explosion of a power semiconductor as a result of the explosion energy, without destroying the hood. An output stage, a converter, and an aircraft are also provided.