An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

An apparatus for obtaining ion energy distribution measurements in a plasma processing system comprising a substrate, a plurality of ion energy sensors each having associated control circuitry disposed in the substrate, and a conductive enclosure disposed in the substrate and surrounding each ion energy sensor and associated control circuitry such that the substrate at least partially surrounds the conductive enclosure.

Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

The present invention relates to a shielding device to reduce the impact of radiation, that contains a container (10) with a receptacle (14) and a functional filling (20) placed into the receptacle (14) of the container (10), where the functional filling (20) is composed of a collecting component (21) that contains a mixture of inorganic substances and a utilizing component (22) that contains a mixture of organic components.

The present invention relates to an electronic device, including a body including an inner frame, a circuit board disposed inside the body to transmit a signal, an electronic component disposed on the circuit board, and a shield can disposed between the circuit board and the inner frame, and covering the electronic component such that a current induced from the electronic component flows toward the circuit board, wherein the shield can includes a base portion including a first region fixed to the circuit board, and a second region covering the electronic component, and at least one magnet portion overlapping the second region of the base portion, and forming a magnetic field in a direction from inside to outside of the base portion so as to disperse the current on the base portion.

The present invention relates to a long-term therapy including repeated treatment courses of ulipristal acetate or any metabolite thereof for treating uterine fibroids. The present invention also relates to a combined therapy applying ulipristal acetate with a progestin in order to improve the currently used treatment for uterine fibroids.

Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).

Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.

An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.