An electromagnetic wave shielding film according to one embodiment of the present invention comprises a substrate and an electrode pattern, which is provided on one surface of the substrate and contains metal particles, wherein the metal particles comprise first particles having sizes within a first range and second particles having sizes within a second range that is smaller than the first range, respectively, the number of second particles is greater than the number of first particles, and at least one first particle is mixed in among the second particles.

An electronic device is provided, which may include at least one housing including a first housing and a second housing, wherein the first housing is movable relative to the second housing; a circuit board disposed in the at least one housing; at least one electronic component disposed on the circuit board; a side wall including a first surface and a second surface opposite to the first surface, wherein the first surface is facing at least a portion of the circuit board; a first heat dissipation structure configured to transfer at least some of heat from the at least one electronic component to the side wall; and a second heat dissipation structure configured to dissipate the at least some of heat transferred by the first heat dissipation structure.

A display device includes: a display panel; a circuit board, one end of the circuit board being connected to the display panel, and the circuit board being at least partially disposed on a back surface of the display panel and includes a device region on a side distal from the display panel; at least one electronic device disposed in the device region; and an adhesive tape disposed on a side, distal from the display panel, of the circuit board and bonded to a back surface of at least a part of the circuit board and the back surface of at least a part of the display panel. At least a part of the at least one electronic device in the device region is disposed between the adhesive tape and the back surface of the display panel.

A display device includes: a display panel; a driving integrated circuit chip configured to drive the display panel; a first printed circuit board connected to the display panel; a second printed circuit board connected to the first printed circuit board; and a cover including a body portion covering the driving integrated circuit chip, the first printed circuit board, and the second printed circuit board, and a wing portion protruding from the body portion, wherein the wing portion extends from a front surface of the display panel to a rear surface of the display panel while surrounding a side surface of the display panel.

An electronic device is provided. The electronic device includes: a housing; a light-permeable display screen received in the housing and including a display area and a black matrix area surrounding the display area; an emitter received in the housing, arranged between the light-permeable display screen and the housing, opposed to the black matrix area, and configured to emit an infrared light through the black matrix area; and a receiver received in the housing, arranged between the light-permeable display screen and the housing, opposed to the black matrix area, and configured to receive the infrared light through the black matrix area.

The present disclosure provides a heat dissipation film, a display device, and a manufacturing method of the display device. The heat dissipation film includes a heat conducting layer and a light shielding layer; an orthographic projection of the light shielding layer in a thickness direction covers an orthographic projection of the heat conducting layer in the thickness direction, and an area of the orthographic projection of the light shielding layer in the thickness direction is larger than an area of the orthographic projection of the heat conducting layer in the thickness direction.

A display device according to an embodiment of the present disclosure may include a display panel; a module cover disposed on the rear side of the display panel; a PCB mounted on the rear surface of the module cover; a side bracket connected to a side of the PCB and restricted by the rear surface of the module cover; and a restriction member restricting the PCB and the side bracket to the module cover and grounding the PCB to the module cover. The restriction member may include a head portion which is in contact with the PCB and restricts the side bracket; and a fastening portion extending from the head portion and fastened to the module cover.

A Faraday cage enclosure for a mobile device with a portion that aligns with a display of the mobile device simultaneously substantially attenuate EM radiation to non-damaging amplitudes and is transparent to visible light in an optical spectrum, an EMP protection circuit electrically connected between the external charging and data port and the internal charging and data port, and a passive repeater configured to EM-couple with an antenna of the mobile device and relay signals to and from the antenna of the mobile device.

A shock absorbing laminate includes: a shock absorbing layer having an adhesive property and a stress relieving property; a heat diffusion layer having a thermal diffusive property, and a shield layer having electromagnetic interference shielding characteristics. The shock absorbing layer, the heat diffusion layer, and the shield layer are stacked on one another. The shock absorbing laminate which has heat dissipation characteristics and electromagnetic interference shielding characteristics and which can be affixed to another member without using the adhesive layer can be provided.

An antistatic ground circuit board and a micro light emitting diode (LED) display including same are provided. The display includes a substrate comprising a first surface oriented toward a first direction, a second surface oriented toward a second direction opposite the first direction, and a side surface oriented toward a third direction perpendicular to the first and second directions, a first circuit unit disposed on the first surface, a second circuit unit disposed on the second surface, a side circuit unit disposed on the side surface and electrically connected to the first circuit unit, a plurality of micro LED chips arranged on one surface of the first circuit unit oriented toward the first direction, and a ground circuit board disposed on the second surface to ground static electricity generated in one or more circuit units from among the first circuit unit, the second circuit unit, and the side circuit unit.