An electronic device can include a housing defining an aperture and at least partially defining an internal volume of the electronic device, an electromagnetic radiation emitter and an electromagnetic radiation detector disposed in the internal volume, and an optical component disposed in the aperture. The optical component can include a first and second transparent portions disposed above the electromagnetic radiation detector and the electromagnetic radiation emitter, and an opaque portion disposed between the first and second transparent portions. A conductive component can be in electrical communication with the opaque portion and one or more components of the electronic device.

The disclosed apparatus may include (1) a cage designed to house an optical transceiver module, wherein the cage includes (A) an entry side that forms an opening for installation and removal of the optical transceiver module and (B) a back side opposite the entry side and (2) an EMI absorber coupled to the back side of the cage to limit an amount of radiated energy that escapes the cage during operation of the optical transceiver module. Various other apparatuses, systems, and methods are also disclosed.

An electronic device for reducing noise occurring in measuring a distance to an external object is provided. The electronic device includes a cover glass, a rear cover facing the cover glass, a display disposed between the cover glass and the rear cover and having a hole formed in a specified area, a shielding layer disposed between the display and the rear cover and having the hole formed in an area corresponding to the specified area, a sensor module disposed in the hole to measure a distance between the electronic device and an external object, a printed circuit board (PCB) disposed between the shielding layer and the rear cover, and at least one processor disposed on the printed circuit board and operatively connected to the sensor module, wherein the sensor module may include a light emitting part that emits light based on a signal received from the processor, and a receiving part to receive the emitted light after being reflected from the external object and returning back, and a diaphragm structure disposed between the light emitting part and the receiving part and including a first region blocking first reflected light reflected from the shielding layer among the emitted light and a second region blocking second reflected light reflected from the cover glass among the emitted light.

Exemplary embodiments are disclosed of EMI shields including electrically-conductive foam (broadly, electrically-conductive resiliently compressible porous material). An exemplary embodiment includes an electromagnetic interference (EMI) shield for an optical transceiver including transmitter and receiver optical sub-assemblies. The EMI shield includes a portion having openings configured for receiving the transmitter and receiver optical sub-assemblies therethrough to thereby allow the EMI shield to be fit over the transmitter and receiver optical sub-assemblies for installation along a portion of the optical transceiver. The EMI shield also includes sidewalls depending from the portion that includes the openings. Electrically-conductive resiliently compressible porous material (e.g., electrically-conductive foam, etc.) is along at least a portion of an outer perimeter defined by the sidewalls.

To provide an electronic apparatus, a camera apparatus, and a shield chassis to be installed in a vehicle and used, whose ground is reinforced. A flexible printed circuit includes an FPC extension portion which is a ground pattern portion extended from a terminal portion for electrically connecting to on the side of the board. On the other hand, a clip portion whose cross-section has an approximately C-shape and whose upper surface includes an opening formed therein is formed at an upper end edge of one wall surface of a shield chassis. A tongue portion of the FPC extension portion, which is inserted through the opening, is sandwiched by the clip portion, such that the FPC extension portion is fixed to the shield chassis.

The invention provides a shield shell that allows easy insertion of a circuit board or other insulator into the shield shell. A shield shell 300 includes a shell body 310 and first and second position restrictors 320a and 320b. The first position restrictor 320a is provided at an edge portion 315 of an insertion port 310 of the shell body 310 and is located inside the insertion port 315. The second position restrictor 320b is provided in the shell body 310 so as to oppose the first position restrictor 320b with a spacing in a Z-Z direction. A distance in the Z-Z direction from the first position restrictor 320a to the second position restrictor 320b is substantially equal to, or slightly larger than, a distance in the Z-Z direction from a first face 101 to a second face 102 of a circuit board 100. When the circuit board 100 is inserted into the shell body 310 through the insertion port 315, the first position restrictor 320a and the second position restrictor 320b are abuttable on the first face 101 and the second face 102, respectively, of the circuit board 100.

A connector assembly is provided which includes a shielding shell, a receptacle connector and a heat sink. The shielding shell has a top wall, a receiving cavity positioned inside, an inserting opening which is positioned at a front end of the shielding shell and communicated with the receiving cavity and a window which is formed to the top wall, extends rearwardly and is communicated with the receiving cavity. The receptacle connector is provided to a rear segment of the receiving cavity. The heat sink is provided to the top wall and includes a heat dissipating base. A bottom face of the heat dissipating base downwardly enters the receiving cavity via the window and directly faces a top face of the receptacle connector. The bottom face of the heat dissipating base facing the receptacle connector is provided with a front stopping portion which is adapted to stop a mating module.

An electronic device can include a housing defining an aperture and at least partially defining an internal volume of the electronic device, an electromagnetic radiation emitter and an electromagnetic radiation detector disposed in the internal volume, and an optical component disposed in the aperture. The optical component can include a first and second transparent portions disposed above the electromagnetic radiation detector and the electromagnetic radiation emitter, and an opaque portion disposed between the first and second transparent portions. A conductive component can be in electrical communication with the opaque portion and one or more components of the electronic device.

A bi-directional optical sub-assembly (BOSA) shielding structure is adapted to wrap a BOSA. The BOSA includes a body, and a first terminal group, a second terminal group, and a third terminal group that respectively protrude from different surfaces of the body. The BOSA shielding structure includes a first shielding member and a second shielding member. The first shielding member is adapted to be sleeved on a part of the body close to the first terminal group, so as to separate the first terminal group from the second terminal group and the third terminal group. The second shielding member is disposed adjacent to the first shielding member and adapted to cover the body and the second terminal group, so as to separate the second terminal group from the third terminal group.

An image forming apparatus includes an image forming unit configured to form an image on a recording material; a fixing unit configured to heat the image in order to fix the image to the recording material; a control board; a support member, wherein the control board is attached to the support member; and a mounting portion, wherein the support member is attached to the mounting portion. The support member includes a side wall. A height of the side wall is smaller than twice a distance between the side wall and the connector on the control board under a state in which the control board is attached to the support member, and is larger than a height from a bottom surface of the support member to an upper surface of the control board.