In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.

A high-frequency module includes a first board on which an electronic device is mounted, a second board on which at least wiring is formed, and a radio-wave absorber disposed between the first board and the second board. Multiple slits are formed in the radio-wave absorber.

An optical module comprising an upper portion of the housing with a bottom and two sides, a lower portion of the housing with a bottom and two sides, an electric component and an electroconductive sheet is provided. The two sides of the upper portion may be inserted between the two sides of the lower portion to form a relatively closed cavity for accommodating the electric component. A first convex block provided on the sides of the upper portion may be inserted into a gap which is formed between a second convex block and a third convex block provided on the sides of the lower portion. Thus, the first convex block, the second convex block and the third convex block may clamp the electroconductive sheet, thereby dividing the gap at the junction of the upper portion and the lower portion into a plurality of tiny gaps.

Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance Hi between the pair of strip conductors and the ground conductor layer is twice or more a distance H.sub.2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.

Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance Hi between the pair of strip conductors and the ground conductor layer is twice or more a distance H.sub.2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.

An electrical assembly includes a metallic cage including a plurality of faces to commonly form a receiving space; a receptacle connector located in a rear portion of the receiving space; and a heat sink member mounted on an outer side of the metallic cage. The heat sink member comprising a first portion located on one of the faces, and a second portion located on another one of the faces. The first portion and the second portion are associated with the metallic cage by different mechanical structures. The first portion and the second portion are thermally connected with each other.

The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

A system and method for testing the quality of a conductor is disclosed. Specifically, a system of testing a conductor using voltage source generator that is capacitively-coupled through the conductor to voltage detector is disclosed. The voltage source generates a varying voltage signal which induces a voltage signal in the capacitively coupled microwire conductor. The voltage detector that is also capacitively-coupled to the conductor measures the induced voltage. Using the detected voltage signal, the voltage detector determines whether there are any conductive breaks in the conductor.

A shield cage assembly of the present disclosure comprises a metal shield shell and a heat dissipating module. The metal shield shell comprises a plurality of walls and an accommodating space defined by the plurality of walls, and the accommodating space has a front end port. The heat dissipating module is assembled to one of the walls of the metal shield shell, and the heat dissipating module comprises a heat dissipating base member, a first heat dissipating member provided to the heat dissipating base member and at least one clip sandwiched between the heat dissipating base member and the first heat dissipating member, and the clip engages with the metal shield shell, a bottom of the heat dissipating base member covers the wall of the metal shield shell to which the heat dissipating module is assembled.

Embodiments of the disclosure pertain to an electromagnetic interference shielding device comprising a base plate, first and second lateral plates connected and oriented orthogonally to the base plate, and at least one top plate connected to and oriented orthogonally to the first and second lateral plates, and a method of manufacturing such an electromagnetic interference shielding device. The top plate(s) further include (i) first and second front or side bends extending toward the base plate from a first side of the top plate(s) and (ii) first and second rear bends extending toward the base plate from a second side of the top plates. The second side of the top plate(s) is different from the first side.