An electronic device includes a signal processor, a substrate, and a conductive housing. The signal processor includes an oscillator that outputs oscillation signal. The substrate has a ground component, the signal processor being disposed on the substrate. The conductive housing is connected to a first site of the ground component and to a second site that is different from the first site. The first site and the second site being disposed at positions where a first area of the housing in which an impedance is higher than a first threshold due to the first site overlaps at least part of a second area of the housing in which an impedance is lower than a second threshold due to the second site.

An electromagnetic pulse (EMP) resistant telecommunications system includes core components mounted within and shielded by a Faraday cage. The components include a data source or storage device. An ethernet switch selectively connects the data source or storage device to a primary satellite router and a post-EMP satellite router. Telecommunications signals are output from and input to the core components via low noise blocks (LNBs) and block upconverters (BUCs). A method of resisting EMP interference for a telecommunications system includes the steps of enclosing and shielding core components in a Faraday cage and providing output via LNBs and BUCs to an antenna subsystem.

Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

Disclosed is an electronic apparatus including a printed board, a plurality of connectors mounted on the printed board, a plurality of communication control circuits that is mounted on the printed board and that controls communication through corresponding ones of the plurality of connectors, and a shield member disposed to face the printed board, in which an annular ground pattern surrounding, without interruption, a shield area including the plurality of communication control circuits is formed on a front surface of the printed board, the plurality of connectors is all disposed outside the ground pattern surrounding the shield area, and the shield member covers the shield area and is fixed to the printed board such that a portion facing the ground pattern is electrically connected to the ground pattern.

Provided is a shield case, including: a case main body configured to cover at least a part of a circuit pattern provided on a mounting surface of a substrate; a flange portion extending from an outer peripheral end portion of the case main body in a direction of separating away from the case main body along the mounting surface; and a bent portion bending and extending from an outer peripheral end portion of the flange portion in a direction of separating away from the mounting surface, wherein the shield case is to be mounted to the substrate by means of a joining member to be provided between the flange portion and a case mounting region of the substrate at which the flange portion is to be arranged, and between the bent portion and the case mounting region.

A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.

Disclosed is an EMI shielding material. The EMI shielding material includes a resin material and metal particles mixed with each other, and the surface of the metal particles has an insulating protective layer. Further disclosed is a communication module product, including a module element arranged on a substrate, and the periphery of the module element that requires EMI shielding is filled with said shielding material. Further disclosed is an EMI shielding process, including the following steps: a. preparing a communication module on which a module element is provided; and b. applying said shielding material to a region of the module element that needs to be EMI shielded on the communication module. The shielding material shields a chip region in a wrapping manner, that is, the shielding material wraps and shields all six surfaces or six directions of the chip, and provides shielding between chips.

A radio frequency module includes a substrate having a first major surface and a second major surface that face each other, a first component disposed on or over the first major surface of the substrate, a second component disposed on the first component, a third component disposed on or over the first major surface of the substrate, and a metallic body connected to a ground. One end of the metallic body is connected to the first major surface of the substrate; and in plan view, the metallic body is disposed between the first component and the third component.

Systems for optimizing mounting points for coaxial RF connectors, including a printed circuit board (PCB) comprising a coaxial radio frequency (RF) connector; a faceplate comprising an opening adapted to receive the coaxial RF connector; and a bushing positioned within the opening, wherein the coaxial RF connector is positioned within the bushing.

Methods and systems capable of launching signal-carrying transverse electromagnetic waves onto a transmission line in the higher voltage region of the transmission distribution network. Such methods and systems may include a surface wave launcher located in the higher voltage region, a network unit located in a lower voltage region, and an arrester separating the surface wave launcher and the network unit, the arrester preventing voltage from arcing over from the higher voltage region to the lower voltage region where the arrester provides the signal to the surface wave launcher.