A method for protecting a substrate from lightning strikes is provided including providing a lightning strike protectant composition to the substrate. The lightning strike protectant composition comprises a reactive organic compound and a conductive filler that, during the cure of the organic compound, is capable of self-assembling into a heterogeneous structure comprised of a continuous, three-dimensional network of metal situated among (continuous or semi-continuous) polymer rich domains. The resulting composition has exceptionally high thermal and electrical conductivity.

An information handling system (IHS) has a lightweight server (LWS) chassis that is user selectable from multiple LWS chassis. Each LWS chassis includes a chassis base having structural configuration that enables placement of the LWS chassis in a nested, stacked configuration with a second LWS chassis placed atop the LWS chassis and a third LWS chassis placed below the LWS chassis. Multiple LWS chassis can be stacked in a vertical space whose height is less than a sum of individual heights of each of the multiple LWS chassis. The IHS further includes compute components inserted into the LWS chassis and one or more connecting cabling interconnecting the at least two compute components.

Provided is a storage tank or structure with conductive fiber material (e.g. carbon fiber) for dissipating electrostatic charge. The tank comprises a tank wall made of composite material, such as polyester-fiberglass composite. On an inner tank surface, open areas are provided in which the conductive fiber is exposed. The conductive fiber material has broken fiber tips and stray fibers for collecting electrostatic charge. Outside the open areas, the conductive fiber material is covered with a layer of cured resin. The conductive fiber is exposed only in the open areas. An impermeable film may be present under the conductive fiber in the open areas. The present invention also includes a method for making the tank, in which a liquid, gel, or impermeable film mask is applied to the conductive fiber material. The mask functions to prevent infiltration of liquid resin into the conductive fiber material.

Embodiments may relate to a microelectronic package comprising: a die and a package substrate coupled to the die with a first interconnect on a first face. The package substrate comprises: a second interconnect and a third interconnect on a second face opposite to the first face; a conductive signal path between the first interconnect and the second interconnect; a conductive ground path between the second interconnect and the third interconnect; and an electrostatic discharge (ESD) protection material coupled to the conductive ground path. The ESD protection material comprises a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and an electrically-conductive polymer chemically bonded to the first functional group and the second functional group permitting an electrical signal to pass between the first and second electrically-conductive carbon allotropes.

An electronic component includes a case body, an electronic circuit, and a conductor portion. The case body is formed by fitting a first housing and a second housing. The electronic circuit board is accommodated in the case body. The conductor portion is formed to continuously extend in a circumferential direction of the electronic circuit board at a portion of the first housing where the first housing is fitted to the second housing. The conductor portion is electrically connected to a ground of the electronic circuit board.

This disclosure discloses a display device including: a display panel; a backlight module including a light-emitting diode group; the display panel including a first substrate and a second substrate successively along the direction from the backlight module, wherein the first substrate includes an exposed area which is not covered by the second substrate, and an orthographic projection of the light-emitting diode group on the first substrate lies in the exposed area; a protective cover plate on the light exit side of the display panel; a housing on the side of the backlight module away from the display panel, and is grounded; and a conductive structure, wherein an orthographic projection of the conductive structure on the first substrate at least partially overlaps with the orthographic projection of the light-emitting diode group on the first substrate, and the conductive structure connects the protective cover plate with the housing.

A composite article includes a lightning strike protection coating on a composite substrate. The lightning strike protection coating is formed from electrically conductive material and includes protrusions spaced along the length and width of a portion of the substrate surface. To form the lightning strike protection coating, a form is pressed against electrically conductive coating material on the composite substrate while the electrically conductive coating material is flowable. For example, the form can be a release film used in a composite vacuum bagging process. Suitable release film can have depressions along an inner surface that define an imprint of the coating protrusions. After curing, the coating can be covered with a layer of paint that conceals the protrusions but still allows lightning streamers to penetrate the paint at the protrusions.

A base tape includes an accommodating section having a rectangular or substantially rectangular parallelepiped, and the base tape includes a surface layer including a carbon layer. The accommodating section includes a bottom surface portion, a side wall portion including a plurality of surfaces, and an opening portion. The side wall portion includes at at least one surface thereof an edge portion located between the bottom surface portion and the opening portion and an electrical discharge path portion inclined from the edge portion toward the opening portion. An electronic component array includes the base tape, an electronic component accommodated in the accommodating section of the base tape, and a cover tape that covers the accommodating section.

An electronic device is provided. The electronic device includes a display panel, a metal layer disposed on a surface of the display panel, a display driver integrated circuit (DDI) disposed on a surface of the metal layer, a bending part connecting the display panel to the DDI, and a cover member connected to the metal layer while covering the DDI. The cover member includes at least one conductive layer. The metal layer and the cover member form a space in which the DDI is disposed, and the bending part is connected to the DDI via a connection part in the space.

Described herein are static dissipating coatings and thermally-stable static-controlled (TSSC) electronic circuits, comprising such coatings. Also described herein are methods of forming such coatings and circuits. In some examples, a static dissipating coating comprises a conductive polymer and a thermally-stable base polymer. The conductive polymer comprises polyaniline and, in some examples, a conductive agent, such as dinonylnaphthalene sulfonic acid (DNNSA), dodecyl benzene sulfonic acid (DBSA), and/or camphor sulfonic acid (CSA). The thermally-stable base polymer comprises one or more copolymers of butyl-methacrylate, such as poly-butylmethacrylate-co-methyl methacrylate (PBM). The amount of the conductive polymer is specifically controlled to ensure the coating's overall conductivity and thermal stability. In some examples, the conductive polymer concentration is at or less than 25% by weight. The conductivity of the coating is between 10.sup.−9 S/cm and 10.sup.−6 S/cm even after being exposed to 150° C. for up to 24 hours.