A sliding door system having one or more sliding doors, door frames (e.g., static frames of different sizes for different wall thicknesses or adjustable frames that can be used to fit different wall thicknesses), sliding door hardware (e.g., tracks, wheels, soft closers, stops, or the like), header, door receiver, a plurality of seals, or the like. The sliding door system utilizes improvements to the components in order to provide security features, such as electromagnetic (EMC—EMI/RFI) shielding, sound resistance, blast resistance, forced entry and/or ballistic resistance, privacy features, light reduction, fire and/or smoke resistance, or the like to the sliding door system. In particular, the sliding door system allows for the use of the security features with the static or adjustable door frames described herein.

Disclosed is a core-shell structured composite powder electromagnetic wave absorber formed by coating Fe-based nanocrystalline alloy with carbon and a preparation method thereof. The core-shell structured composite powder includes a core of an Fe-based nanocrystalline alloy, and a shell of an amorphous carbon layer, the shell accounting for 5-25 wt % of the core-shell structured composite powder electromagnetic wave absorber, wherein the core-shell structured composite powder electromagnetic wave absorber has a particle size of 3-10 μm; the Fe-based nanocrystalline alloy has a composition formula of Fe.sub.bal.Si.sub.aB.sub.b, where atomic percentage contents of Si and B are 3-15 respectively, and a balance is the atomic percentage content of Fe.

An electromagnetic wave absorbing sheet is provided that can adequately absorb electromagnetic waves at high frequencies in and above the millimeter wave band, can have excellent flexibility, and can easily be placed in any desired portion. The electromagnetic wave absorbing sheet includes an electromagnetic wave absorbing layer 1 containing a magnetic iron oxide 1a that magnetically resonates at frequencies in and above the millimeter wave band and a resin binder 1b. The electromagnetic wave absorbing sheet absorbs radiated electromagnetic waves by magnetic resonance of the magnetic iron oxide. The electromagnetic wave absorbing sheet has a flexibility evaluation value F (g/mm.sup.2) of more than 0 and 6 or less, which is determined by measuring an applied weight (g) that is required to bend a ribbon-like electromagnetic wave absorbing sheet in the elastic deformation region so that a distance d between the inner surfaces of the ribbon-like sheet at a position L spaced 10 mm from the bent portion of the ribbon-like sheet is 10 mm, and dividing the applied weight (g) by a cross-sectional area D (mm.sup.2) of the ribbon-like sheet.

The present disclosure relates to a silicone composition for use as a temporary bonding adhesive comprising: (A) a polydiorganosiloxane having at least two alkenyl groups in each molecule; (B) a polyorganosiloxane having at least one silicon-bonded hydrogen atom in each molecule; and (C) a thermally expandable powder having an expansion ratio of 10 or more.

A radio wave absorber includes hexagonal ferrite particles and a holding material-filled with the hexagonal ferrite particles. The hexagonal ferrite particles include first particles and second particles that are larger than the first particles in particle size.

An acoustic device comprises a shell and a sound producing assembly, the shell being provided with an installation hole and a sound outlet, and the sound producing assembly being fixed inside the shell. The sound producing assembly has a diaphragm separating a cavity of the acoustic device into a front cavity and a back cavity, a first part of the shell corresponding to the front cavity and/or a second part of the shell corresponding to the back cavity is provided with sapphire glass covering the installation hole, and the front cavity is in communication with the outside of the acoustic device through the sound outlet.

The present disclosure relates to the technical field of microwave absorption, and in particular, to a multi-layer wave absorber structure and use thereof. The multi-layer wave absorber structure has a sandwich structure, and an intermediate layer of the sandwich structure is an electromagnetic loss-free dielectric layer. The electromagnetic loss-free dielectric layer includes a vacuum layer, an air layer, a paraffin layer, or a polytetrafluoroethylene layer. The added electromagnetic loss-free dielectric layer enhances impedance matching by modulating phases of electromagnetic waves, such that loss of the electromagnetic waves in a composite wave absorbing layer of the multi-layer wave absorber structure is enhanced, and an effective absorption bandwidth is further improved. The multi-layer wave absorber structure provided by the present disclosure has higher universality and operability, and has an effect of improving an effective absorption bandwidth for wave absorbing devices made of various composite wave absorbing materials.

A battery pack includes a rack housing having a cabinet and a door provided to open and close the cabinet; a plurality of battery modules disposed in the cabinet in a layered form; a plurality of slave modules mounted to the battery modules one by one and having a slave antenna for wireless communication; a master module disposed at one of interlayer, top and bottom of the plurality of battery modules and having a master antenna for wireless communication; and a waveguide installed at an inner surface of the door to form a wireless communication path between the plurality of slave modules and the master module.

A waveguide structure includes at least one transmission line and at least one conductive pattern layer. At least a portion of the transmission line and at least a portion of the conductive pattern layer overlap each other as observed from a surface side of the conductive pattern layer. A surface electrical resistance value of the conductive pattern layer is in a range of 0.005 Ω/□ to 30 Ω/□.

A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.