A method of molding a metalized composite part. The method comprises: introducing particles comprising at least one metal into a gas stream; directing the gas stream toward a surface of a thermoplastic composite part, thereby depositing a metal layer on the composite part to form a metallized composite part; and molding the metallized composite part to introduce a bend without delamination of the metal layer from the metallized composite part.

Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor devices include a package substrate, a stack of dies carried by the package substrate, and one or more radiation shields configured to absorb neutrons from neutron radiation incident on the semiconductor device. The radiation shields can include one or more walls attached to a perimeter portion of the package substrate at least partially surrounding the stack of dies and/or a lid carried over the stack of dies. Each of the radiation shields can include hydrocarbon materials, boron, lithium, gadolinium, cadmium, and like materials that effectively absorb neutrons from neutron radiation. In some embodiments, the semiconductor devices also include a molding material over the stack of dies and the radiation shields, and a hydrocarbon coating over an external surface of the mold material.

The present invention discloses a conductive plastic, based on the total mass of the conductive plastic, which includes: a resin with a low melting point 42%-54%; a toughened resin 4%-10%; carbon black 33%-47%; a dispersant 1%-3%; wherein, the toughened resin is a polymer of acrylic acid and siloxane; and use thereof. The conductive plastic of the present invention has a low melting temperature and high conductive performance, and is suitable for a wire cable shielding layer.

An electronic assembly for handling a storage module is provided. The electronic assembly includes an open frame structure having a front frame including a front opening configured to receive air, and two side rails coupled to opposite sides of the front frame. Each side rail includes a side opening and an extended portion. The side opening is configured to direct the air received by the front opening at least partially out of the open frame structure. The extended portion extends from the side opening and away from the front frame and is configured to hold a storage module. The electronic assembly includes a lever bar coupled in proximity to the opposite sides of the front frame and having a lock position that is configured to lock the storage module onto a chassis base and a release position that is configured to release the storage module from the chassis base.

A printed circuit board (PCB) module may include a PCB with at least one internal PCB element and at least one external PCB element, a shielding layer fabricated from a tunable metamaterial absorber, and a structure housing the PCB. The at least one internal PCB element may be embedded between adjacent layers of the PCB. The at least one external PCB element may be coupled to an exterior surface of the PCB. The shielding layer may be tuned in response to the at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement. The tuning of the shielding layer may include adjusting a plurality of fins within a plurality of elements of the metamaterial absorber to absorb at least a portion of the EMI emission.

The present disclosure provides an electromagnetic shielding film, a flexible circuit board and a display device. The electromagnetic shielding film includes a central portion and an edge portion. The central portion has a plurality of surrounding side edges; and the edge portion is provided on at least one side edge of the central portion, and includes a plurality of protruding units protruding away from the central portion. The plurality of protruding units are arranged in an extending direction of the side edge where the edge portion is located. The electromagnetic shielding film is used to attach on a flexible circuit board body, the central portion is located on a non-bending area, and the edge portion is located on a bending area, so that the flexible circuit board is formed.

A central compute unit, configured for a vehicle, a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The main frame for mounting and connecting vehicular components in a vehicle includes a plurality of slots configured to support a plurality of pocket modules. A main frame interface is configured to connect the plurality of pocket modules with a communication network, and to couple the plurality of pocket modules with a cooling circuit.

A metal-foam structure is used to shield or reduce harmful electromagnetic waves that are generated by electronic devices. A metal-foam material has regulated pores and is incorporated in an electronic device. The metal foam structure shields, prevents, or reduces harmful electromagnetic waves generated by the electronic device from reaching the human body or interfering with a sensitive electronic component. This metal foam is a relatively lightweight material having regulated microscale pore structure. The pores in the metal foam can also form directionality relative to the direction of incoming electromagnetic waves for more effective reflection or absorption of electromagnetic waves. The metal foam can also be used as both an electromagnetic-shielding and a heat-dissipating component for electronics including popular consumer electronics such as mobile phones, notebooks, and high-power desktop computers.

A substrate unit of an embodiment includes a plurality of substrates and a holding part. The plurality of substrates are arranged at a constant interval in a thickness direction. The holding part integrally holds the plurality of substrates and allows, relative to one substrate of the plurality of substrates, another substrate to be movable along a plane direction of the substrate.

A non-invasive eddy current flow meter embedded into a coolant channel for measuring the coolant flow velocity of liquid metal coolant in a nuclear reactor. The eddy current flow meter measures the coolant flow velocity in pool-type nuclear reactors and narrow coolant channels without creating bottlenecks that impede the coolant flow within the nuclear reactors.