Electromagnetically shielding an enclosable structure having a floor, walls, a ceiling, and at least one closeable opening by applying a shielding wallcovering to at least a portion of one of the walls and applying a second type of shielding material to at least a portion of the enclosable structure, wherein the second type of shielding material differs from the shielding wallcovering. The shielding wall covering is wallpaper comprising a metal-coated broad good and a resin. Other types of shielding material may include a transparent, shielding window covering such as NiCVD coated screen of woven silk fibers; shielded flooring such as a layered combinations of Kevlar non-woven as a base layer, nickel-coated non-woven layers, and a PCF toughened polymer; and a transition shielding strip made of a base layer of the shielding wallpaper with a PCF toughened polymer coating over a portion of the strip.

The embodiments are directed to protecting objects having sensitive electronics from high power radio frequency (HPRF) interference signals. An object with the sensitive electronics has a thin film applied to the object's outer surface. The thin film conforms to the object's outer surface contours. The thin film has a substrate foundation, an array in intimate adjacent contact with the substrate foundation. The array has a plurality of radio frequency (RF) witness films overlain on the substrate foundation. Each RF witness film in the plurality of RF witness films is equally-spaced from adjacent RF witness films.

A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.

A semiconductor package including a package substrate including a ground layer, a first segment of which is exposed to outside the package substrate, a semiconductor chip on the package substrate, and a functional layer including a conductive polymer and an adhesive polymer, covering the semiconductor chip, and being in contact with the first segment of the ground layer may be provided.

The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.

An impedance matching film 10 includes a mixture containing indium oxide and tin oxide and being a main component of the impedance matching film, the mixture having an amorphous structure. The impedance matching film 10 for impedance matching has a Hall mobility of 5 cm.sup.2/(V.Math.s) or more. The impedance matching film 10 has a thickness of 16 nm or more and less than 100 nm.

An method for making a shielding assembly includes the steps of: forming a plurality of active layers, wherein each active layer of the plurality of active layers includes a base material and a fluorescent molecule; and forming a multi-layer laminate including the plurality of active layers.

The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.

An electromagnetic wave shielding material is provided that is configured to prevent a usage environment from being limited. The electromagnetic wave shielding material shields an electromagnetic wave having a frequency, and includes a substrate and a plurality of resonance loops disposed on the substrate. Moreover, the plurality of resonance loops are positioned on the substrate to be magnetically coupled to each other. Each of the resonance loops forms an LC parallel resonance circuit that resonates at the frequency of the electromagnetic wave.

A composite layer including first and second layers is described. The first layer includes a plurality of metallic nanowires and the second layer includes a polymeric overcoat disposed on the nanowires. In top plan view, the composite layer has at least one first region and at least one second region, where the nanowires in each first region form an interconnected network of the nanowires, and each second region includes a plurality of nanotrenches through the second layer into the first layer.