Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

A substrate magazine for a substrate insertion system, having a frame in which several drawers for receiving in each case at least one flat substrate are arranged one above the other. Each drawer is formed by two guide rails, arranged in parallel and at a distance from one another at the same height as that of the frame, each with a sliding surface on which a substrate lying on the edge can be displaced. At least one elastically displaceable latching element is assigned to each drawer. In a first, unloaded state, the at least one latching element extends at least partially over the sliding surface of one of the guide rails of the drawer and, in a second, elastically deformed state, releases the sliding surface.

A backup pin configured to support from below a circuit board can be one of a soft backup pin or a hard backup pin. The soft backup pin includes a soft pin portion formed of a soft elastic material and configured to support from below the circuit board and an engaging pin portion configured to be held in engagement and released from engagement by an engagement holding tool attached to a mounting head of the component mounter performing raising and lowering, as well as rotating operations, the soft pin portion and the engaging pin portion being provided side by side. The engaging pin portion is formed into a shape common to an engaging portion of the hard backup pin which is held in engagement by the engagement holding tool.

An assembly device for assembling a screw into a locking hole of a circuit board includes an assembled board and a guiding sleeve. The assembled board is configured to press against a circuit board. The guiding sleeve is movably arranged in the assembled board. A vertical channel is formed in an interior of the guiding sleeve. When the assembled board presses against the circuit board, one end of the guiding sleeve abuts against the circuit board, and the vertical channel is opposite to the screw hole on the circuit board. The screw is accurately assembled into the screw hole of the circuit board, thereby improving assembly efficiency.

A mounting device for executing a mounting process of mounting a component on a board includes: a mounting head that includes at least one pickup section for picking up the component and moves the picked up component; a storage section configured to store at least a first correction value determined at a first position on XYZ axes on which the mounting head works and a second correction value determined at a second position different from the first position; and a control section configured to execute the mounting process by using the first correction value and/or the second correction value stored in the storage section.

A component mounting system comprising: a stage configured to scatter components; a holding tool configured to move over the stage and hold components from the stage; a storage device configured to store positional information of components on the stage that the holding tool failed to hold; and a control device configured to control the operation of the holding tool so that components are held while excluding components in the positional information stored in the storage device from becoming holding targets.

A substrate working machine including: a conveyance device configured to convey a substrate; a holding device configured to hold the substrate conveyed to a work position by the conveyance device; and a control device configured to control operation of the conveyance device, wherein the control device is configured to control the operation of the conveyance device such that the substrate is conveyed at a conveyance speed calculated based on a preset setting time and a conveyance distance of the substrate from the work position by the conveyance device or a conveyance distance of the substrate to the work position by the conveyance device.

Tooling for engaging with a workpiece has a body and a spring section formed as a monolithic structure from a resilient material. At least three deformable arms connect a movable shuttle to the body, the arms being configured to enable constrained movement of the shuttle relative to the body.

An electronic component mounting method is performed by an electronic component mounting system including a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The electronic component mounting method comprises mixedly distributing the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.

A first conveyor belt and second conveyor belt are disposed on guide rail which is disposed so as to extend in a circuit substrate conveyance direction. Then, the circuit substrate supported by both the conveyor belts of the first conveyor belt and the second conveyor belt is held by substrate holding device, and work is performed on the held circuit substrate. In the transfer device having such a structure, for example, when the circuit substrate on which an operation has been completed is conveyed out by the second conveyor belt, a new circuit substrate is conveyed into the transfer device by the first conveyor belt. In this way, it is possible to perform printing work on a new circuit substrate at an early stage and shorten a cycle time.