Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

A tool for supporting multilayer printed circuit boards during manufacture having a frame in which there is fixed a pretensed, non-electrically conductive fabric which has a thickness less than 0.1 mm and which can be accessed by its two faces. The tool allows the induction bonding of the layers at internal points of the bundle following a method in which the bundle is placed on the tool and at least one of the welding electrodes used in the welding operation is applied on the lower face of a fabric of the tool supporting the bundle. A machine especially suitable for putting the method into practice includes C-shaped magnetic cores, the arms of which are long enough to reach the internal points of the bundle.

Tape feeder holding device includes slide section on which a tape feeder can be slid, the tape feeder supplying electronic components by feeding tape housing the electronic components in a tape feeding direction; and sliding device configured to slide the tape feeder held in the slide section in the tape feeding direction, the sliding device being capable of sliding the tape feeder to a supply position at which the electronic components can be supplied from the tape feeder. That is, with the tape feeder holding device, a tape feeder is automatically attached to the tape feeder holding device.

Based on the measured values of the electrical characteristics of multiple components including a component positioned in the middle among many components held on the component tape, it is possible to more accurately estimate the electrical characteristics of the many components as compared with the case based on the measured value of the electrical characteristic of a component positioned at the leading end. Also, based on the statistically processed results of these measurement values, it is possible to appropriately evaluate the electrical characteristics of many components. Further, if the electrical characteristics of all of the components are measured, the evaluation can be performed more appropriately.

A system for manufacturing an assembly board includes an undersupporting device, a transporter configured to transport a board and the undersupporting device, an undersupporting-device installer provided below the transporter, the undersupporting-device installer being attachable to and detachable from the undersupporting device, a board processor configured to perform a predetermined processing to an upper surface of the board, a carry-in side delivering unit having first and second receiving positions different from each other, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The transporter transports, to the carry-in side delivering unit, the undersupporting device detached from the undersupporting-device installer. The carry-in side delivering unit positions, at the second receiving position, the undersupporting device delivered from the transporter to allow the undersupporting device to be carried out from the second receiving position.

System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers, to the transporter, the undersupporting device supplied to the second receiving position. The transporter transports, to a working position, the undersupporting device delivered from the carry-in side delivering unit. The undersupporting-device installer fixes, to the undersupporting-device installer, the undersupporting device transported to the working position. The carry-in side delivering unit delivers, to the transporter, the board supplied to the first receiving position. The transporter transports, to the working position, the board delivered from the carry-in side delivering unit.

A system for manufacturing an assembly board includes an undersupporting device, a carrier configured to hold the undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, and a magnet provided on a lower surface of the undersupporting device. The transporter transports the undersupporting device to a working position by transporting the carrier to the working position while the carrier holds the undersupporting device on the lower surface of the carrier. The transported undersupporting device is fixed to the undersupporting-device installer by a magnetic force of the magnet at the working position. The transporter transports the board to the working position. The undersupporting device supports the lower surface of the board when the board is transported to the working position. The board processor performs a predetermined processing to an upper surface of the board.

The present invention provides a maintenance board that can be used for a maintenance process other than removing static electricity from a component mounting device by being conveyed by a conveyance device of the component mounting device. The maintenance board is conveyed to the conveyance device of the component mounting device. The maintenance board includes at least one of: a brush configured to brush a maintenance target object; a cleaning nozzle configured to be held in an attachable manner to a work head of the component mounting device and to blow air to the maintenance target object; a pressure sensor configured to measure a detachable load of a component to a suction nozzle attached to the work head and a mounting load of a component to a board; and a blower configured to blow air toward the work head.

A device for attachment of double-sided adhesive and a method for attachment of the double-sided adhesive are provided. The device includes a driver, a platform and a robot arm provided above the platform. The robot arm is connected with the driver and configured to, under the driving of the driver, place the double-sided adhesive onto a preset position of the platform, strip off the first protective film of the double-sided adhesive at the preset position, press the printed circuit board assembly (PCBA) at the preset position against the double-sided adhesive without the first protective film, and unload the PCBA attached with the double-sided adhesive from the preset position. A positioning structure is provided at the preset position and configured to secure the adhesive layer and the second protective film when the robot arm strips off the first protective film, and release the securing of the adhesive layer and the second protective film when the double-sided adhesive is attached to the PCBA.

A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.