For a component receiving member provided with a component reception recess shaped according to a component that is a storage target, and side wall section that a component held by suction nozzle contacts when moved in the left-right direction, when the component is released in a state contacting the side wall section, the component is stored in the component reception recess by leads of the component falling along a tapered surface and the component rotating 90 degrees due to its own weight. Therefore, even in a case in which the component is held by suction nozzle with an upper surface facing up, the component is stored in the component reception recess with the upper surface facing up by the component rotating 90 degrees at the component receiving member.

A loose component supply device provided with component supply apparatus that stores multiple components, frame to which the component supply apparatus is detachably attached, claw member for locking the component supply apparatus to the frame, and a component support member that supports multiple component in a scattered state, the components having been ejected from an entrance of the component supply apparatus that is attached to the frame; the locking of the component supply apparatus to the frame is released by an operator grasping grip of the component supply apparatus. The component supply apparatus is swung, and with the swinging linking mechanism is operated such that shutter rotates downwards. That is, with the releasing of the locking of the component supply apparatus, the entrance of the component supply apparatus is covered by the shutter.

A feeding assembly and a method of feeding components comprising a track along which components can be moved, said track comprising a sloped surface and a ledge, wherein said sloped surface slopes in a direction perpendicular to the direction which the components move along the track so that the components maintain a tilted orientation as they move along the track, a pickup platform comprising a pocket which can receive components from said track, and a pivot on which the pickup platform can be selectively rotated between a first position and second position. In the first position, the pocket is aligned with the track and the pocket is parallel with the sloped surface of the track, so that a component can move from the track into the pocket of the pickup platform. In the second position the pocket is in a horizontal orientation.

A fall impact reducing apparatus for reducing an impact on a falling chip component includes a wire assembly which is formed by stacking a plurality of wire jigs. The wire jig includes a plurality of wires arranged parallel to each other at intervals which allows the chip component C to pass through the wire jig, and the wire jig is formed of an integral body by working a base material having a predetermined thickness, the integral body constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. When the chip component is made to fall on the wire assembly, the chip component collides with the wire of any one of wire jigs.

A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. The protrusion and the cavity cooperate to form a substantially continuous surface for transferring the electronic devices to the separator.

Templates to arrange and/or align components for batch placement on a substrate are described. A batch placement template can include a number of detents physically arranged relative to each other corresponding to a physical arrangement of components to be placed on a substrate. The detents can be sized to allow components to be manipulated into the detents and subsequently picked and placed on the substrate in a batch process.

Multiple types of leaded components 410a, 410b, and 410c are scattered on component support member 285, and those multiple types of components are imaged by an imaging device. Identification information for identifying each type of the multiple types of components, and position information representing the position of the components on the component support section, is acquired from image data captured by the imaging device 84. Then, based on the identification information and the position information, any of the multiple types of components on the component support member 285 are held by a holding tool. By this, it is possible to pick up any of the multiple types of components scattered on the component support section 285 and it is possible to supply many types of components using the component supply device 32. Also, there is no need for an operator to check components on the component support section 285, so the operator workload is reduced.

A component supply device, configured to supply an electrical component in a state of being placed in a placement section, comprising: multiple placement sections, in which an electrical component positioned by a positioning section is placed in each placement section, and a detection device, configured to detect displacement in the up-down direction of the electrical components placed in the multiple placement sections.

A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

A component supply device includes a storage section, a mounting section, and a component support section. The storage section stores multiple components. The storage section is mounted to the mounting section. The storage section is attachable and detachable in relation to the mounting section. The component support section supports, in a scattered state, multiple components which are discharged from an opening of the storage section which is in a state of being mounted to the mounting section.