An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

A nozzle holding mechanism of the invention is capable of holding multiple types of nozzles to a head of a component mounting device and includes: a magnet provided in a holding section of the head; and a magnetic material, attracted to the magnet, provided in a held section of the nozzle on the side held by the holding section of the head, at a position facing the magnet. The magnetic material is provided so as to have a gap between the magnetic material and the magnet while the nozzle is held by the head. The gap is adjusted to be larger or smaller in accordance with the type of the nozzle held by the head.

An electronic component mounting machine including a board clamp device configured to clamp a circuit board conveyed by a conveyor by sandwiching side edge sections of the circuit board between a clamp member from below and a conveyor rail from above by raising the clamp member, the electronic component mounting machine being configured to mount electronic components on the circuit board clamped by the board clamp device; and a control device configured to control a clamping force that is a sandwiching force on the side edge sections of the circuit board sandwiched between the clamp member and the conveyor rail of the board clamp device. The control device is configured to acquire board information including at least a weight of the circuit board and to control the clamping force of the board clamp device based on the acquired board information.

A mounting system of the present disclosure includes a mounting line having multiple mounting machines aligned side by side in a predetermined arrangement and configured to mount a component on a board, a supply device configured to convey members for use in the mounting machines and supply the members to the mounting machines by traveling in the arrangement direction, and a reporting section configured to issue a warning when the members are not supplied to the mounting machines by the supply device.

An automatic backup pin arrangement operation includes a backup plate facing a lower surface of circuit board where backup pins stored in a stock areas are picked up with an XY-robot to be automatically arranged at positions of the backup plate designated in a production job. In a case where there is no free space in the stock areas for an unnecessary backup pin removed from the backup plate to be placed when a production job for changing the arrangement of the backup pins is switched, at least a part of a region of the backup plate facing a lower surface of the circuit board, which does not interfere with a mounted component on a lower surface side of the circuit board, is used as retraction area, and the unnecessary backup pin that cannot be retracted to the stock area is retracted to the retraction area.

Provided is a method for the throughput-optimised production of printed circuit boards on least two assembly lines, wherein: the printed circuit boards are divided into clusters; each cluster is produced using a set-up system that is carried out by changeover tables that can be attached to the assembly line, each changeover table having at least one feed device for keeping ready stocks of components; and a changeover table set and an empty changeover table set comprises changeover tables with feed devices that are empty.

A gantry-type positioning device includes first and second cross members. Two linear guides are disposed parallel to each other on a base and support the first and second cross members such that the cross members are movable in a first direction. A Y-carriage has a functional element and is supported on the first cross member such that the Y-carriage and the functional element are movable in a second direction. A position-measuring device is disposed on the second cross member and the Y-carriage such that a position of the Y-carriage relative to the second cross member is detectable. A Z-carriage supports the functional element such that the functional element is movable relative to the Y-carriage in a third direction. A further position-measuring device is disposed on the Y-carriage and the functional element such that a position of the functional element relative to the Y-carriage is detectable.

Provided is a method for determining the maximum number of constant tables at table locations in one or more pick-and-place lines for the placement of components on modules using pick-and-place machines, the fittings on the constant tables being used in all the fitting families of a pick-and-place line, one fitting family including a set of modules which can be produced on a pick-and-place line with a common component fitting, wherein the maximum number of constant tables is determined by calculation using mixed-integer liner optimization on the basis of input data describing the pick-and-place infrastructure, wherein the pick-and place infrastructure can include in particular the pick-and-place lines having the pick-and-place machines, each with pick-and-place head, at least one transport system for the modules, the said constant tables, and further tables which can be variably fitted.

The present invention provides a component mounting machine (1) comprising a picking tool (2) for picking electronic components (3) from a source (4) of electronic components and placing them onto a workpiece (5), a verification unit (6) for measuring an electrical property of an electronic component (3) picked and held by the picking tool (2). The verification unit (6) comprises a board (7), a plurality of test electrodes (8) arranged on a surface (9) of said board (7) and a system (10) for measuring an output signal from the test electrodes (8) upon contact between a picked electronic component (3) and at least two of said test electrodes (8). Further, at least one test electrode (8) is arranged on a flexible portion (11) of the board (7) that is configured to flex upon engagement between a picked electronic component (3) and said at least two test electrodes (8).

An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code. The steps performed by execution of the code may include receiving sensor data from the sensor indicative of at least a physical location the off-center fiducial; dividing the board into radial sections based on the sensor data; accessing at least one placement program for placement of at least first components by the pick and place machine; monitoring for a change to a second at least one of the radial sections based on rotation of the rotational table according to the sensor data; and accessing at least one second placement program for placement of second components upon a change to the physical location.