An automatic backup pin arrangement operation includes a backup plate facing a lower surface of circuit board where backup pins stored in a stock areas are picked up with an XY-robot to be automatically arranged at positions of the backup plate designated in a production job. In a case where there is no free space in the stock areas for an unnecessary backup pin removed from the backup plate to be placed when a production job for changing the arrangement of the backup pins is switched, at least a part of a region of the backup plate facing a lower surface of the circuit board, which does not interfere with a mounted component on a lower surface side of the circuit board, is used as retraction area, and the unnecessary backup pin that cannot be retracted to the stock area is retracted to the retraction area.

In a component mounter including a component holding tool configured to hold lead of a lead component, a position of mark given to the component holding tool and a position of a distal end of the lead are calculated based on captured image data, and when a distance between the position of the mark and the position of the distal end of the lead is smaller than a threshold, mounting work is performed, whereas when the distance is equal to or greater than the threshold, the mounting work is not performed. As a result, for example, mounting work on a lead component having a lead which is greatly bent can be avoided, thereby ensuring proper mounting work.

A multiple lens-based smart mechanical arm, wherein it comprises a multi joint multi-functional mechanical arm, a CCD camera for collecting PCB board images to be assembled, a bio-contact device, and a computer; the CCD camera is mounted on the multi joint multi-functional mechanical arm, the bio-contact device is mounted on the fingertip of the multi joint multi-functional mechanical arm, and the CCD camera, and the bio-contact device and the multi joint multi-functional mechanical arm are connected to the computer. The invention adds a biological tactile device on the basis of the binocular positioning to accurately locate the assembly target area and improve the accuracy of the assembly of the irregular parts. The conversion relationship between the pressure and electric output of the sensitive material in the bio-contact device and the mathematical model of pressure and position is applied. The present invention realizes high-precision and real-time assembly of irregular parts and improves the production efficiency of the electronic assembly industry.

A component feeding device includes a tape lead-in mechanism that leads a component storage tape into a tape traveling path. A pair of tape holding portions are coupled to an operating lever such that the pair of tape holding portions are allowed to shift in posture between a holding posture in which the pair of tape holding portions are able to hold the component storage tape and a hold releasing posture in which the pair of tape holding portions release their hold on the component storage tape. As a result of turning together with the turned operating lever, the pair of tape holding portions shift in position between a send-off enabling position and a send-off disabling position at which the component storage tape is released from a state of being sent off. At the send-off disabling position, the pair of tape holding portions takes the hold releasing posture.

A method for manufacturing an array device includes a placing step of providing a plurality of elements in an array on a first surface of a substrate, an element separating step of separating a plurality of element chips from one another so that each element chip includes one or more elements, an inspecting step of inspecting the plurality of elements, a removing step of removing any element chip of the plurality of element chips from the surface of the substrate on the basis of a result of the inspecting step, and a mounting step of, after the removing step, mounting an element of at least the elements other than an element of the element chip thus removed onto a mounting substrate by transfer from the substrate, the mounting substrate being different from the substrate.

One or more embodiments are directed to cap attach trays for holding barrel caps such that a pick-and-place tool can readily identify the cap and pick the barrel cap from the cap attach tray during the manufacturing process. The cap attach trays include a receiving layer having a plurality of protrusions each of which secures a barrel cap by mating to a through-hole in the barrel cap.

Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.

Provided is a component mounting device including: an XY robot, a Z-axis slider attached to an X-axis slider of the XY robot so as to be movable in the Z-axis direction, a head loaded on the Z-axis slider, and a nozzle attached to head 30 so as to be movable in the Z-axis direction. With the component mounting device, a component supplied from a component supply unit is picked up by the nozzle, transported to a specified position on a board, and mounted. A flexible section with an external appearance with a U shape that is expandable and contractible in the X-axis direction and the Z-axis direction is arranged to the rear of a Y-axis slider. A portion of an X-axis wiring tube and a portion of a Z-axis wiring tube are bundled together in the flexible section.

A component mounting machine includes a mark imaging camera that images a board mark of a circuit board and has a function of identifying an identification target, such as a character attached to an upper surface of a component supplied by a component supply device. An illumination light source illuminates the identification target on the upper surface of the component imaged by the mark imaging camera and is attached to a lower portion of an electric component holding frame provided to protrude to the side of the mounting head. As the identification target on the upper surface of the component, which is illuminated by the illumination light source from obliquely above, is imaged by the mark imaging camera from above and the image is processed, the identification target on the upper surface of the component is identified.

A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.