A machine that is used to automate the assembly of a circuit board assembly is provided. The machine includes a rotating indexer, at least one anvil holder, a punch, and an activation switch. The at least one anvil holder is carried by the rotating indexer and is configured to receive a connector pin. The anvil holder is rotatable relative to the punch, such that the at least one anvil holder may be aligned with the punch. A circuit board may be located about the connector pin, after which the activation switch may be activated to cause movement of the punch towards the anvil holder. When this occurs, the connector pin is compressed, which causes the connector pin to be secured to the circuit board. More specifically, a top section of the connector pin is compressed to form a top lip, where the circuit board is located between the top lip and a shoulder of the connector pin.

A component supply device includes a storage section, a mounting section, and a component support section. The storage section stores multiple components. The storage section is mounted to the mounting section. The storage section is attachable and detachable in relation to the mounting section. The component support section supports, in a scattered state, multiple components which are discharged from an opening of the storage section which is in a state of being mounted to the mounting section.

In rotary head type component mounter, provided at two locations around rotary head are Z1-axis drive mechanism and Z2-axis drive mechanism that lower suction nozzles, and in a case in which the interval between two suction nozzles is a multiple two times or greater than the arrangement pitch of components in tray, component mounter performs consecutive simultaneous pickup operation repeatedly for a quantity corresponding to the quantity of component arrangement pitches between the two suction nozzles, the consecutive simultaneous pickup operation being that of lowering the two suction nozzles simultaneously such that two of the components on tray are picked up simultaneously, then rotating rotary head by one nozzle pitch, moving rotary head in the arrangement direction of the components on tray by one component arrangement pitch, and then lowering the next two suction nozzles simultaneously such that another two of the components on tray are picked up simultaneously.

A packaged integrated circuit transfer track with a stopper arm that is constrained to vertical motion. A packaged integrated circuit transfer track with a cam follower that engages a cam causing a stopper arm to raise or lower vertically. A packaged integrated circuit transfer track with an actuator that engages a switch causing a motor or solenoid to raise or lower the stopper arm vertically.

An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

A machine that is used to automate the assembly of a circuit board assembly is provided. The machine includes a rotating indexer, at least one anvil holder, a punch, and an activation switch. The at least one anvil holder is carried by the rotating indexer and is configured to receive a connector pin. The anvil holder is rotatable relative to the punch, such that the at least one anvil holder may be aligned with the punch. A circuit board may be located about the connector pin, after which the activation switch may be activated to cause movement of the punch towards the anvil holder. When this occurs, the connector pin is compressed, which causes the connector pin to be secured to the circuit board. More specifically, a top section of the connector pin is compressed to form a top lip, where the circuit board is located between the top lip and a shoulder of the connector pin.

A component supply device includes a pallet configured to allow a tray to be arranged thereon, a magazine operable to hold a plurality of pallets, and a magazine holder configured to allow the magazine to be arranged therein. The magazine holder is configured to allow the pallet to be conveyed from the magazine that has been arranged to a component supply position. The component supply device further includes a magazine supply unit configured to supply the magazine to the magazine holder, a magazine ejection unit configured to receive the magazine ejected from the magazine holder, and a magazine conveyance unit configured to convey the magazine from the magazine supply unit to the magazine holder.

In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

A component mounter for mounting electronic components includes a mounting head with at least two suction nozzles in the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously. A control device, which is configured to control electronic component pickup and mounting operations, causes the mounting head to move so as to position the at least two suction nozzles that are lowered simultaneously in an electronic component pickup operation step to be located individually on at least two trays on the pallet, causes the at least two suction nozzles to be lowered simultaneously, and causes electronic components on the at least two trays to be picked up simultaneously.

A memory device memorizes a link between an orientation of a leaded component supported on a component support section and a type of component holding tool used for holding the leaded component of the orientation is memorized in a memory device. Also, the component support section on which multiple leaded components are scattered is imaged by an imaging device, and orientations of leaded components supported on the component support section are identified based on the captured image data. Then, the component holding tool of a type memorized as being linked to the identified orientation of leaded component is decided as the component holding tool for holding the leaded component. By this, it is possible to exchange a component holding tool according to an orientation of a leaded component, thus it is possible to hold leaded components of various orientations using component holding tools.