Patent classifications
H05K13/0452
CONTROL DEVICE OF ELECTRONIC COMPONENT MOUNTING MACHINE AND DATA INPUT DEVICE FOR CONTROL DEVICE THEREOF
The control device controls an operation of a mounting head of an electronic component mounting machine. The control device is used when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles. In the control device, some of the multiple divided boards within the printed circuit board are set as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board. In addition, in the control device, the multiple suction nozzles suck the electronic components to be mounted on the divided board within one group at the same time.
Component mounting system
A component mounting system includes: a mounting line in which multiple component mounting machines, each including a component supply device, are arranged in a predetermined direction; a mobile work device, moving along the predetermined direction, which at least replenishes each of the component mounting machines with the component supply device or recovers the component supply device from each of the component mounting machines, and a management device transmits a signal to the mobile work device via a communication path. The communication path is an optical wireless communication path provided along the predetermined direction.
Component mounting device
A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, and a control unit that determines a mounting state of another component mounted in advance around the mounting position based on height information of a region around the mounting position.
Component mounting machine and method for determining dropping of component
A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.
COMPONENT MOUNTING SYSTEM AND METHOD FOR SUPPLYING ELECTRONIC COMPONENT
A component mounting system includes: a tape-type component supply feeder detachably attached to a component mounting machine for mounting an electronic component on a board, having a component feeding mechanism feeding out the electronic component to be accommodated in a tape to a supply position, and configured to supply the electronic component fed to the supply position to the component mounting machine; a storage section configured to store shape data of the electronic component; and a control section configured to determine a speed from a time when the electronic component is fed to the supply position to a time when the electronic component is stopped by the component feeding mechanism, based on the shape data of the electronic component.
Changeover operation configuration device, and changeover operation configuration method
A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information.
Operation management system and component mounting system
A work management system includes a part resupply management unit that manages a plan of part resupply work and a collection management unit that collects waste material data and manages the collection work to be executed in future. The part resupply management unit includes a resupply target specifying unit that specifies a resupply time zone and a target mounting machine, and a work planning unit that extracts a plurality of the target mounting machines with the resupply time zones overlapping each other and that creates a work plan to make a patrol of the target mounting machines and execute the resupply work at the target mounting machines. When a need of the collection work to be executed has arisen at the target mounting machine, the work planning unit creates a work plan to execute both the resupply work and the collection work for the target mounting machine.
MICROSTRUCTURE-TRANSFER APPARATUS, STAMP HEAD UNIT, STAMP COMPONENT FOR TRANSFERRING MICROSTRUCTURE, AND METHOD FOR TRANSFERRING MICROSTRUCTURE-INTEGRATED COMPONENT
A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.
Chuck for holding mounting component, and component mounting machine
A chuck for holding a mounting component including: multiple claw units each having multiple claws configured to contact a section to be held of a component to be mounted on a board, the claw units being arranged at predetermined positions separated from each other; and a claw unit opening and closing mechanism configured to open and close each of the multiple claw units.
Component mounter
A component mounter including a mounting head having multiple holding bodies, a revolving mechanism configured to revolve the multiple holding bodies along a revolution trajectory, a rotating mechanism configured to cause the multiple holding bodies to rotate on their axes in synchronism with each other, a detection section configured to detect a component located in one or more component detection positions which are different from the component pickup positions on the revolution trajectory from a side thereof; and a control section. The control section performs component pickup processing for causing the mounting head to cause at least one of the holding bodies located in the component pickup position to pick up and hold the component and holding body revolving processing for causing the revolving mechanism to locate the holding body that does not hold the component.