A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.

A component supply device including a component storage device that stores a plurality of components, a component support member on which the components from the component storage device are dispersed, and a component return device that returns the components on the component support member to the component storage device, is provided. In a case where the necessary number of components exceeds the number of holdable components, return work of the components to the component container and dispersal work of the components to the component support section are carried out prior to holding the components from the component support section by the component holding tool.

A work management system includes a part resupply management unit that manages a plan of part resupply work and a collection management unit that collects waste material data and manages the collection work to be executed in future. The part resupply management unit includes a resupply target specifying unit that specifies a resupply time zone and a target mounting machine, and a work planning unit that extracts a plurality of the target mounting machines with the resupply time zones overlapping each other and that creates a work plan to make a patrol of the target mounting machines and execute the resupply work at the target mounting machines. When a need of the collection work to be executed has arisen at the target mounting machine, the work planning unit creates a work plan to execute both the resupply work and the collection work for the target mounting machine.

A component mounting system includes: a mounting line in which multiple component mounting machines, each including a component supply device, are arranged in a predetermined direction; a mobile work device, moving along the predetermined direction, which at least replenishes each of the component mounting machines with the component supply device or recovers the component supply device from each of the component mounting machines, and a management device transmits a signal to the mobile work device via a communication path. The communication path is an optical wireless communication path provided along the predetermined direction.

An assembly system comprises a fixing device configured to fix a housing and a pressing mechanism adapted to assemble a contact into the housing. The pressing mechanism includes a fixing block having a contact guiding slot adapted to receive the contact therein and a movable block movably mounted on the fixing block and adapted to press the contact downward. The movable block is moved downward to press the contact received in the contact guiding slot into a contact installation slot of the housing in a condition in which the contact guiding slot of the fixing block is aligned with the contact installation slot of the housing.

A component mounting system that includes a unit exchange device configured to automatically exchange the component supply unit and a processing section configured to determine whether the attachment and detachment of the component supply unit is performed according to the attachment and detachment instruction based on the attachment and detachment record acquired by an acquisition section and the instruction list, and when it is determined that the attachment and detachment is performed according to the attachment and detachment instruction, to perform an update process to update the instruction list by deleting the corresponding attachment and detachment instruction.

To provide a control device and a control method of a component mounting machine which is capable of improving the accuracy of mounting control. In a case where the holding member is moved from a current position to a predetermined processing position within the component mounting machine, the control device of the component mounting machine moves a holding member to a preparation position which is set to a defined propelling direction and distance with respect to the processing position, and then moves the holding member from the preparation position to a mounting position.

A CPU of a management computer sets an nth component in a mounting operation order of the current sequence as a target component, calculates nearby state data of the target component, sets the required accuracy of the target component based on the nearby state data and memorizes the required accuracy of HDD. Because the required accuracy is automatically set based on the nearby state data in this manner, the set required accuracy matches actual circumstances better compared to than with conventional technology. Therefore, it is possible to automatically set appropriate required accuracy of a target component.

A component transfer device including: a component mounting tool mounted on a movable mounting head, the component mounting tool being configured to collect a component from a component supply device and mount the component on a board; a side imaging section configured to image the component held by the component mounting tool from the side; a cleaning nozzle having an emission port on a side surface only of the cleaning nozzle that opens toward the side imaging section; and a positive pressure air supply section configured to supply positive pressure air to the cleaning nozzle and blow out the positive pressure air from the emission port toward the side imaging section.

A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit (10) for separating a flip-chip (200) from a carrier (100) and providing the flip-chip (200), the supply unit (10) including flipping device (11); a transfer unit (20) for receiving the flip-chip (200) from the flipping device (11); a position adjustment unit (30) for adjusting the positions of flip-chips (200) on the transfer unit (20); a bonding unit (40) for bonding the flip-chips (200) on the transfer unit (20) onto a substrate (400); a transportation unit (50) for transporting the transfer unit (20); and a control unit (60) for controlling the movement of the preceding units. The transfer unit (20) is capable of receiving multiple flip-chips (200) and allows the flip-chips (200) to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput. Moreover, during the transportation of the transfer unit (20), the positions of the flip-chips (200) thereon can be adjusted by the position adjustment unit (30), thereby ensuring high positional accuracy of the flip-chips (200) in the subsequent bonding step. As a result, a high-accuracy bonding can be achieved.