A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

A main printed circuit board of electronic equipment includes through-holes and into which a plurality of types of components are attached. Lands are respectively provided around the through-holes and to electrically connect the components to a main printed circuit board. Shapes of the lands correspond to shapes of components attached to the through-holes. For example, in automatic mounting of components, the shapes of the lands are determined by image recognition, and components with shapes corresponding to the shapes of the lands are attached.

A component mounting system includes a component mounting line in which a plurality of processing devices are connected to constitute the component mounting line and a management device (management computer) connected to the component mounting line by a network, and each of the plurality of processing devices can be remotely operated via the network by an input unit of the management device. In this component mounting system, a remote operation right allowing a remote operation is set with respect to the management device (ST21), and the remote operation right set with respect to the management device is released (ST23) in a case where a specific operation set in advance with respect to the one or more processing devices is performed (Yes in ST41) in a state where the remote operation right is set with respect to the management device.

A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and which is mounted to be capable of moving between the component supply position and the board, includes determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component.

A method for mounting an electronic component (180) onto a component carrier (179) is described. The method comprises (a) optically capturing a first image from a first side of the component (180), at which first side a first structural feature (185) of the component (180) is discernible, by means of a first camera (120), (b) optically capturing a second image from a second side of the component (180), at which second side a second structural feature (186) of the component (180) is discernible, by means of a second camera (160), wherein the first side and the second side are situated opposite one another and wherein the second structural feature (186) is configured to be connected at a predetermined position on the component carrier (175), (c) orienting the electronic component (180) such that a center of the first structural feature (185) is aligned with a desired position relative to the component carrier (175), wherein the second structural feature (186) can be correspondingly offset from the predetermined position, and (d) mounting the electronic component (180) onto the component carrier (175), wherein the center of the first structural feature (185) is aligned relative to the component carrier (175), wherein the second structural feature (186) is offset from the predetermined position. Moreover, a method for checking the functionality of an optoelectronic component in advance of a population of a component carrier and an automatic placement machine for mounting an optically measured electronic component are also described.

Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later.

A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.

A component mounting machine performs a mounting operation of mounting an electronic component to a board. The component mounting machine includes: multiple related operation devices each including an electrically-operated section configured to perform a related operation that is an operation related to the mounting operation, and an output section configured to output an operation signal representing a state of the electrically-operated section that is operating; and circuitry configured to limit the quantity of the related operation devices for which the electrically-operated section is in an operating state to a specified quantity or fewer based on whether there is presence of the operation signal of the multiple related operation devices.

A handheld communication device includes first and second screens, a hinge to rotate the first and second screens between open and closed positions, and a position sensor to determine the relative position of the first and second screens. The position sensor can be a Hall-Effect sensor.

Methods and devices for selectively presenting a user interface in a dual screen device. More particularly, the method includes providing a gallery for the dual screen device. The gallery can present one or more images in a user interface. The gallery user interface can adapt to changes in the device configuration. Further, the gallery can display images or videos in the various configurations.