A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

The invention relates to a method for equipping a mounting plate (1) with equipping components (2) of a switchgear and/or control system, the method comprising the steps: Reading planning data of a switchgear and/or control system into an automatic equipping machine (3), which has a equipping robot (4); Extracting position data of at least one equipping component (2) to be mounted on the mounting plate (1) and/or at least one machining position of the mounting plate (1) from the planning data; Detecting a spatial orientation and/or a position of the mounting plate (1) with an image processing system (5) of the equipping robot (4); Assigning the position data to at least one position on the mounting plate (1); and Execution of at least one processing or equipping step linked to the position on the mounting plate (1) via the planning data at the position on the mounting plate (1) with the equipping robot (4).

A component supply device comprises: a main body including a tape path which guides a component supply tape being sent in a longitudinal direction to a component supply position, and an introducing region which communicates with the tape path on a side opposite to the supply position in the longitudinal direction and introduces the supply tape into the tape path; and a tape position switching mechanism which switches the position of the supply tape in a vertical direction with respect to the tape path on the side opposite to the supply position. The tape position switching mechanism includes a supporter movable between a supporting position for supporting the supply tape from below and a non-supporting position separated from the supporting position in a width direction of the supply tape. The supporter releases the supply tape to move the supply tape downward from the supporting position to the non-supporting position.

An electronic device is provided with an electronic component having a base material and a terminal electrode formed on a first surface of the base material, and a circuit substrate in which a pad for mounting the electronic component is formed on a first surface. A hole for light transmission is formed in the pad, and the pad and the terminal electrode are electrically and mechanically connected to each other with a cured product of optical firing paste obtained by receiving light from a second surface that is a surface opposite to the first surface of the circuit substrate.

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

In a component supply device, an opener is configured to move in a second direction with movement of a tape in the second direction when the tape is fed in the second direction opposite to a first direction in which the tape is fed from a tape feeder to the opener.

An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

The present invention can provide a measurement device, a measurement method, and a bonding system, which enable estimation of the state of the underside of an electronic component mounted on a substrate. A measurement device performs measurements on an electronic component that is mounted on a main surface of a substrate, the measurement device comprising: a measurement part that measures a component height position, which is the height of the upper surface of the electronic component, and a substrate height position, which is the height of a non-mount region of the main surface of the substrate where the electronic component is not mounted; and an estimation part that estimates position information relating to a mount region of the main surface of the substrate where the electronic component is mounted, on the basis of the component height position and the substrate height position as measured by the measurement part.