A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

The object is to provide a technique for predicting a time for performing maintenance of optical communication in an electronic component mounting device in which optical communication is performed. A controller in a time prediction process reads the voltage of an electrical signal from a storage section, calculates the slope with respect to time of the read voltage, and based on the amount of decrease with time of the voltage outputted from an AD converter, the time at which the voltage becomes to be equal to or less than a threshold value is calculated. The time at which the output value of the optical signal outputted from the mounting head will become equal to or less than the threshold value is then estimated.

A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.

Methods and systems for presenting a user interface that includes a virtual keyboard are provided. More particularly, a virtual keyboard can be presented using one or more touch screens included in a multiple display device. The content of the virtual keyboard can be controlled in response to user input. Configurable portions of the virtual keyboard include selectable rows of virtual keys. In addition, whether selectable rows of virtual keys and/or a suggestion bar is displayed together with the standard character and control keys of the virtual keyboard can be determined in response to context or user input.

A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.

This invention relates to integrating pixelated micro-devices into a system substrate. Defined are methods of transferring a plurality of micro-devices into a receiver substrate where a plurality of micro-devices is arranged in one or more cartridges that are aligned and bonded to a template. Further, defining the transfer process, the micro-devices may be selected, identified as defective and a transfer adjustment made based on defective micro-devices.

Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

The method for producing the electric module comprises: securing at least one first electrical component (108, 110) to a first plate (102); then assembling each first electrical component (108, 110) to an electrical connection bar (104) to which at least one second component (120) is already secured.

A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.