Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.

A control device is used for a mounting device with a mounting head including at least a first holder on which a first pickup member is installed, and a second holder on which a second pickup member is installed, and configured to pick up components supplied from a component supply section and mount the components. The control device includes a control section configured to acquire a first deviation amount of a tip of the first pickup member and a second deviation amount of a tip of the second pickup member and select a combination of the pickup members in which an interval between the tips of the pickup members that is obtained based on the first deviation amount and the second deviation amount falls within a predetermined range.

In an embodiment a transfer tool includes an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip and a device configured to adjust a surface area of the adhesive surface, wherein the adhesive stamp is deformable, wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp, wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and wherein the adhesive surface is free of interruptions.

A system and method for aligning components is disclosed. A system arranges a plurality of components in a first component alignment. The system places two L-shaped fine placement tools in a position surrounding the plurality of components, wherein the L-shaped fine placement tools include a plurality of pins. The system applies a force to the pins included in the two L-shaped fine placement tools to shift the plurality of components from the first component alignment to a second component alignment, wherein the second component alignment has less unused space than the first component alignment. The system removes the two L-shaped fine placement tools. The system attaches the plurality of components to a carrier arranged in the second component alignment.

An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Component mounting line includes multiple component mounting machines arranged along a conveyance direction of a board, feeder storage container that stores multiple feeders that are attachable and detachable to component mounting machine, and exchanging robot capable of exchanging feeder between feeder storage container and each of the component mounting machines, in which feeder storage container is installed in the same arrangement as the multiple component mounting machines, and exchanging robot moves along the conveyance direction of the board and exchanges feeder. Accordingly, regardless of which of the component mounting machines feeder is used in, replenishment and collection may be performed in feeder storage container, so that an operator can easily replenish and collect feeder.

The present disclosure is directed to an apparatus and method of batch assembly. The apparatus for batch assembly may include a plurality of spring units, a plurality of handling units, and a control unit. The method of batch assembly may include aligning an array of devices with a plurality of handling units, attaching the array of devices onto the handling units, expanding the handling units so as to expand the array of devices from a first area to a second area, and transferring the array of devices to a destination.

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

An electronic component mounting method for two types of boards, using an electronic component mounting system in which multiple mounters are arranged in series; the mounters include a board conveyance device having a first conveyance lane that loads the first board and a second conveyance lane that loads the second board, and a component transfer device having a first mounting head and a second mounting head; a portion of multiple mounters are set as independent production mounters and the remaining portion are set as second lane dedicated mounters; mounting a first set of electronic components on the first board is allocated to the first mounting heads of the independent production mounters; and mounting a second set of electronic components on the second board is allocated to the second mounting heads of the independent production mounters and to the first mounting heads and the second mounting heads of the second lane dedicated mounters.

A method of manufacturing an electronic device including the following steps is provided herein. Providing a plurality of first electronic components on a first structure. Providing a plurality of receiving sites on a second structure. Performing a first transferring, including transferring at least portion of the plurality of first electronic components onto at least portion of the plurality of receiving sites on the second structure. Figuring out an empty receiving site from the plurality of receiving sites, wherein the plurality of first electronic components is absent at the empty receiving site. Performing a second transferring, including transferring a second electronic component onto the empty receiving site on the second structure. Providing a target substrate, and transferring the at least portion of the plurality of first electronic components and the second electronic component on the second structure onto the target substrate.