The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. In some examples, the smart devices, smart phones and touchscreen devices may have two touchscreens on opposite sides of the device along with hardware based encryption.

A component mounting line configured to move an automatic exchanging device that performs setting and removing of feeders of multiple component mounters, including a position detecting device that detects the position of the automatic exchanging device is configured from a timing belt with an end and provided to extend in a straight line along the moving lane on the front side of the component mounting line, a timing pulley that moves together with the automatic exchanging device while maintaining a state in which the teeth of the timing pulley are engaged with the teeth of the timing belt, and a rotary encoder that outputs a rotation angle of the timing pulley, and the pulse output of the rotary encoder is counted to detect the position of the automatic exchanging device.

The information processing device is a device used in a mounting system configured as a production line including a mounting device configured to mount components on a board. The information processing device comprises: a control section configured to obtain the operator workload to be performed within a time block between a first point-in-time and a second point-in-time based on correspondence information linking work content and operator working time required for the work content, and the production job of the production line; create a workload table linking the time block and the workload; and output the created workload table.

A work system includes multiple work devices aligned along a board conveyance line, a replenishing device having a sensor for detecting presence or absence of an interfering object and configured to move in parallel with the board conveyance line while detecting the presence or absence of the interfering object by the sensor to replenish necessary members to the multiple work devices, and a draw-out device configured to draw out at least one of the multiple work devices in a direction orthogonal to a direction along the board conveyance line. When a draw-out request for the work device is made, the replenishing device performs an automatic draw-out process of moving to a position in which a draw-out position of the work device to be pulled forward is included within a detection range of the sensor, so as to determine whether the interfering object is detected by the sensor.

Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.

An automatic exchanging device is provided which moves alongside the front face of a component mounting line. When an automatic exchange request for a feeder is generated in any of multiple component mounting machines constituting the component mounting line, the automatic exchanging device moves to the front of the component mounting machine in which the automatic exchange request was generated to automatically exchange the feeder. When a new automatic exchange request is generated in any one of the component mounting machines, a pull-out operation of a predetermined number of component mounting machines is prohibited, from the component mounting machine facing the automatic exchanging device toward the position of the component mounting machine in which the new automatic exchange request was generated.

With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter.

An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from the product conveyance system and move the second of the products from the product conveyance system to a second placement location.

A component supply device including a component storage device that stores a plurality of components, a component support member on which the components from the component storage device are dispersed, and a component return device that returns the components on the component support member to the component storage device, is provided. In a case where the necessary number of components exceeds the number of holdable components, return work of the components to the component container and dispersal work of the components to the component support section are carried out prior to holding the components from the component support section by the component holding tool.

A component supply device including a component storage device that stores a plurality of components, a component support member on which the components from the component storage device are dispersed, and a component return device that returns the components on the component support member to the component storage device, is provided. In a case where the necessary number of components exceeds the number of holdable components, return work of the components to the component container and dispersal work of the components to the component support section are carried out prior to holding the components from the component support section by the component holding tool.