A component mounting line includes a first and a second component mounting devices. The first component mounting device adheres anisotropic conductive members to a region of a part of one side and a region of the other side of the substrate, temporarily crimps electronic components onto the region of the part of the one side and the region of the other side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the other side. The second component mounting device adheres the anisotropic conductive members to remaining regions of the one side of the substrate, temporarily crimps the electronic components onto the remaining regions of the one side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the part of the one side and the remaining regions of the one side.

A component mounting apparatus includes transport mechanisms that transport boards, component supply sections, mounting heads, and a control unit that controls them based on mounting data. Each transport mechanism includes an upstream side operation area and a downstream side operation area. When the mounting data corresponds to an independent mounting mode in which each of the mounting heads is used to mount a component only onto a board on a corresponding mechanism, the control unit performs a control so that the upstream side operation area is used as a mounting area. When the mounting data corresponds to an alternating mounting mode in which both mounting heads are used to mount the components sequentially onto a board that is first carried into the downstream side operation area, the control unit performs a control so that the upstream side operation area is used as a standby area.

A component supply device including a component storage device that stores a plurality of components, a component support member on which the components from the component storage device are dispersed, and a component return device that returns the components on the component support member to the component storage device, is provided. In a case where the necessary number of components exceeds the number of holdable components, return work of the components to the component container and dispersal work of the components to the component support section are carried out prior to holding the components from the component support section by the component holding tool.

With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter.

Component mounting equipment includes a first transfer line, a second transfer line, and a surface mounting equipment on the first transfer line and the second transfer line. The surface mounting equipment includes a first mounting head, a second mounting head, and a controller. The controller is configured to control the surface mounting equipment so that the surface mounting equipment performs continuous mounting. In the continuous mounting, the surface mounting equipment is configured to perform either separate mounting or collaborative mounting while giving priority to the separate mounting. Through the component mounting equipment, it is possible to automatically perform continuous mounting and preceding mounting based on the order of substrates detected on the first transfer line and the second transfer line, thereby reducing delays and congestion in mounting operations.

Various embodiments include a method for parameterizing an electronics production line using device parameters of a reference production line. The electronics production lines each include: a device to apply joining material to component carriers, a placement device to place electronic components onto the component carriers, a joining device to connect the electronic components to the component carriers, and a transport system to transport the component carriers through the devices. An example method includes: parameterizing the devices of the production line using parameters of the reference line; ascertaining actual parameter values in a limited region around the transport system; and ascertaining deviations between the actual process parameter values and reference process parameter values. The reference process parameter values have been acquired in a limited region around the transport system of the reference production line.