An image processing device for processing an image of a tape in which multiple cavities for accommodating a component are provided along a predetermined feeding direction includes a generation section configured to extract brightnesses of pixels of a line along the feeding direction from the image and to generate a brightness waveform of the line, and a recognition section configured to execute a periodic analysis of a brightness change from the brightness waveform and to recognize a pitch of the cavities based on a wavelength obtained by the periodic analysis.

A method for detecting errors or malfunctions in electrical or electronic components of circuits, wherein each of the circuits is located on a circuit board and wherein a plurality of circuit boards border one another on a circuit board panel, includes populating each of the circuit boards of the circuit board panel with electrical or electronic components corresponding to the circuits; for each of the analog, electrical or electronic components used for the construction of the circuits, placing a corresponding test component in an edge region of the circuit board panel; providing the analog, electrical or electronic test components placed in the edge region of the circuit board panel with test points; and checking for the correct function value and/or the correct poling of the analog, electrical or electronic test components provided with test points and located in the edge region of the circuit board panel.

A physical object processing system is described that includes a process station, a transport facility, an optical imaging system, an image sensor and data process facilities. The transport facility transports objects along the process station that performs processing steps to the object. The image sensor acquires a digital image from an optical image of the physical objects provided by the optical imaging system. The data process facilities in turn process the digital image to control the process station. The optical imaging system maps the optical image of the at least one physical object onto the image sensor at an at least substantially fixed position during a time-interval for acquiring the digital image.

In some examples, a system derives a first representation of an assembly of components based on a first source of information, and derives a second representation of the assembly of components based on a second source of information that is of a different type than the first source of information, where the second representation includes any or a combination of an indication of a source of a respective component of the assembly of components, or placement location information of a component in the assembly. The system compares the first representation to the second representation to identify a deviation between the first representation and the second representation, the deviation corresponding to an alteration of the assembly of components.

A board conveyance device and conveyance belt inspection method that enable easy detection of a problem with conveyance belts. The board conveyance device includes: endless conveyance belts on which is set a conveyance path for conveying a board; a board sensor configured to detect the presence of the board at a specified detection position on the conveyance path; and a control section configured to, in a case in which the board is not being conveyed on the conveyance path, move the conveyance belts and determine a problem with the conveyance belts based on a detection result of the board sensor.

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

An electronic component supply apparatus transports a component supply tape which has accommodation sections and sprocket holes formed at regular intervals and which accommodates electronic components in the accommodation sections and is covered with a cover tape, to a component picking-up position and supplies each of the electronic components accommodated in each of the accommodation sections to a component mounting apparatus. The electronic component supply apparatus includes an electronic component detecting unit that detects the electronic component accommodated in the accommodation section of the component supply tape which has yet to pass the cover tape processing unit on a transport path; a determination unit that determines presence or absence of an electronic component in the accommodation section based on information from the electronic component detecting unit; and a control unit that controls a component supply tape transport unit based on a determination result of the determination unit.

A main printed circuit board of electronic equipment includes through-holes and into which a plurality of types of components are attached. Lands are respectively provided around the through-holes and to electrically connect the components to a main printed circuit board. Shapes of the lands correspond to shapes of components attached to the through-holes. For example, in automatic mounting of components, the shapes of the lands are determined by image recognition, and components with shapes corresponding to the shapes of the lands are attached.

A component supply device, configured to supply an electrical component in a state of being placed in a placement section, comprising: multiple placement sections, in which an electrical component positioned by a positioning section is placed in each placement section, and a detection device, configured to detect displacement in the up-down direction of the electrical components placed in the multiple placement sections.