A mounting system of the present disclosure includes a mounting line including multiple mounting machines aligned side by side in a predetermined arrangement direction and configured to mount components on a board, a supply device configured to move in the arrangement direction to convey members for use in the mounting machines and supply the members to the mounting machines, and a display section provided on each of the mounting machines and configured to change their display modes in accordance with a movement of the supply device.

A device for inspecting a suction nozzle includes an imaging device configured to acquire an image by imaging a flange portion of a suction nozzle having a body cylinder and the flange portion protruding from an outer surface of the body cylinder, and a control device configured to execute an inspection process for determining whether the flange portion is defective based on the image.

In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.

An informing device includes a loading section feeding automatically a subsequent component tape that is preset in the tape feeder when the component tape that is being fed by the feeding device has no component. A controller is configured to determine whether the component tape that is being fed by the feeding device and the subsequent component tape are present in the tape feeder or only one of the component tape and the subsequent component tape is present in the tape feeder based on a management table, and configured to control a display section to inform that the subsequent component tape can be preset in the tape feeder before the subsequent component tape is preset when only one of the component tapes is present in the tape feeder.

In a component supply device, an opener is configured to move in a second direction with movement of a tape in the second direction when the tape is fed in the second direction opposite to a first direction in which the tape is fed from a tape feeder to the opener.

A device for aligning and optically inspecting a semiconductor component arranged on a receiving tool that is arranged on a turning mechanism. The device aligns the semiconductor component in relation to a center of the receiving tool in at least one axis direction and/or a direction of rotation. The turning mechanism is designed to rotate about a turning axis and to move the semiconductor component out of a receiving position into an offset position, with two slides that can be moved towards and away from each other and comprise slide sections, the two slide sections coming to rest on two lateral surfaces of the semiconductor component, at least in sections, in order to align the semiconductor component arranged on the receiving tool, the slide being defined such that it slides and/or rotates the semiconductor component into an inspection position, while the receiving tool holds the semiconductor component.

A movement error detection apparatus includes a plurality of marks including a fifth mark (movable region inside mark) arranged in a movable region of a movable conveyor and first to fourth marks (movable region outside marks) arranged outside the movable region of the movable conveyor; a substrate recognition camera (imaging device to move together with a mounting head to image the first to fifth marks; and a projection device (auxiliary device) to assist an imaging. The first to fourth marks are arranged on a horizontal reference plane including a substrate, and the fifth mark is arranged at a position which is lower than the horizontal reference plane and at which the movable conveyor is not interfered. The projection device absorbs a height difference between the fifth mark and the horizontal reference plane to assist the substrate recognition camera in picking up a focused image of the fifth mark.

A component mounting apparatus includes a nozzle that sucks a component supplied from a feeder, conveys the component to a predetermined position on a substrate, and mounts the component in the predetermined position. The component mounting apparatus controls an XY-robot to perform repeatedly the component mounting operation while performing a thermal correction from a start of the component mounting operation as a result of a power supply being turned on until an amount of positional deviation due to heat from the XY-robot reaches a steady state. After the steady state is achieved, the component mounting apparatus controls the XY-robot to perform repeatedly the component mounting operation while performing a steady state correction using a correction amount resulting immediately after the steady state is achieved without performing the thermal correction and controls the XY-robot to perform a dummy operation for maintaining the steady state during a standby period.

A component supply device includes a plurality of kinds of tape feeders capable of mounting a first component storing tape by which supplying of components is performed precedingly, and a second component storing tape by which supplying of components is performed succeedingly; a component sensor configured to detect runout of the components in the first component storing tape; and a control unit configured to control a tape feeding operation. A specified discharge length by which the first component storing tape is discharged at the time of occurrence of the runout of the components is preliminarily set for each kind of the tape feeder. The control unit is configured to make the tape feeder perform a tape feeding operation for feeding the first component storing tape by the specified discharge length when the component sensor detects the runout of the components in the first component storing tape.

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.