H05K13/081

Modular system for automated portable electronic device disassembly

This application relates to a method for disassembling a portable electronic device. The method can include generating data associated with disassembling the portable electronic device based on measurements of a housing of the portable electronic device, removing a display assembly from the housing using a first module of a modular system based on the measurements of the housing, and removing an energy storage component from the housing using a second module of the modular system based on the measurements of the housing.

Modular system for automated portable electronic device disassembly

According to some embodiments, a method for processing an electronic component associated with a portable electronic device by a conveyor system subsequent to removing the electronic component from a housing of the portable electronic device, where the conveyor system includes a container that is capable of carrying the electronic component, is described. The method can include depositing, at a receiving station of the conveyor system, the electronic component within a cavity of the container. The method can further include while moving the container that carries the electronic component from the receiving station in a direction towards a removal station of the conveyor system: monitoring a temperature of the electronic component, and in response to determining that the temperature of the electronic component exceeds a temperature threshold range associated with a thermal event: cooling the electronic component by dissipating thermal energy associated with the thermal event.

Image processing device and board production system
11004177 · 2021-05-11 · ·

An image processing device capable of reducing the load of image processing while shortening the time required for the image processing which uses super-resolution processing. The image processing device includes a process determination section which determines an execution necessity of the super-resolution processing in relation to image data during execution of a production process for every type of target object, a super-resolution processing section which executes the super-resolution processing which uses a plurality of items of the image data according to determination results of the process determination section to generate high resolution data, and a state recognition section which recognizes a state of the target object based on, of the image data and the high resolution data, the one corresponding to the determination results of the process determination section.

Mounting work machine
11032958 · 2021-06-08 · ·

A component supply device including a component storage device that stores a plurality of components, a component support member on which the components from the component storage device are dispersed, and a component return device that returns the components on the component support member to the component storage device, is provided. In a case where the necessary number of components exceeds the number of holdable components, return work of the components to the component container and dispersal work of the components to the component support section are carried out prior to holding the components from the component support section by the component holding tool.

INFORMING DEVICE AND INFORMING METHOD
20210161043 · 2021-05-27 · ·

An informing device includes a loading section feeding automatically a subsequent component tape that is preset in the tape feeder when the component tape that is being fed by the feeding device has no component. A controller is configured to determine whether the component tape that is being fed by the feeding device and the subsequent component tape are present in the tape feeder or only one of the component tape and the subsequent component tape is present in the tape feeder based on a management table, and configured to control a display section to inform that the subsequent component tape can be preset in the tape feeder before the subsequent component tape is preset when only one of the component tapes is present in the tape feeder.

SYSTEM FOR MONITORING OUTSIDE WORK AREA OF COMPONENT MOUNTING MACHINE
20210168976 · 2021-06-03 · ·

A component mounting includes an external monitoring camera that images an outside work area that is an area outside of the component mounting machine at which an operator performs work with respect to the component mounting machine. The outside work area of the component mounting machine includes at least an area where a feeder is set, and a monitoring target is at least a state during and after completion of setting the feeder on the component mounting machine and during and after completion of setting component supply tape on the feeder. By looking at a recorded image or a real time image displayed on a display device by using the external monitoring camera to capture an outside work area of the component mounting machine, it is possible to check the state of the monitoring target on which an operator performed work in the outside work area of the component mounter.

Component mounter
11006561 · 2021-05-11 · ·

A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.

CAPACITOR CHARGING PERFORMANCE MONITORING SYSTEM OF PRODUCTION MACHINE
20210132159 · 2021-05-06 · ·

A system for monitoring the charging performance of a capacitor in an electric circuit in a manufacturing machine installed in a production line includes a charging voltage detecting section for detecting the charging voltage of the capacitor. A control device of the production machine measures, as the charging time, a time from starting charging to a time when a specified charging complete determination voltage that can be used to determine when the charging voltage of the capacitor has reached full charge is reached based on the charging voltage of the capacitor detected by charging voltage detecting section, determines whether the capacitor has deteriorated by determining whether the measured charging time is equal to or less than a specified deterioration threshold value, and upon determining that the capacitor has deteriorated, issues a warning to an operator via a display or sound.

METHOD FOR INSPECTING MOUNTING STATE OF COMPONENT, PRINTED CIRCUIT BOARD INSPECTION APPARATUS, AND COMPUTER READABLE RECORDING MEDIUM

A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

METHOD FOR INSPECTING MOUNTING STATE OF COMPONENT, PRINTED CIRCUIT BOARD INSPECTION APPARATUS, AND COMPUTER READABLE RECORDING MEDIUM

A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.