Techniques are presented for the application of neural networks to the fabrication of integrated circuits and electronic devices, where example are given for the fabrication of non-volatile memory circuits and the mounting of circuit components on the printed circuit board of a solid state drive (SSD). The techniques include the generation of high precision masks suitable for analyzing electron microscope images of feature of integrated circuits and of handling the training of the neural network when the available training data set is sparse through use of a generative adversary network (GAN).

A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

In a component mounting machine, before the suction nozzle held by the rotary head is automatically exchanged, the nozzle ID codes of all suction nozzles arranged on the nozzle station are continuously read at a high speed and stored in association with the position of each suction nozzle. Sequentially imaging the nozzle ID code display section of each suction nozzle of each column is performed without stopping the mark imaging camera while moving the camera in an arrangement direction of the suction nozzle of each column of the nozzle station. The movement direction of the camera is reversed each time the last imaging operation of one column is completed and the camera is moved to imaging an adjacent column and the nozzle ID code of each suction nozzle of each column read at the image processing is stored in the storage in association with the position of each suction nozzle.

A system for detecting electronic components includes a light-source device, a photography device, an adjustment device, and an image-processing device. The light-source device generates a light to illuminate at least one pin of a first electronic component at different rotation angles. The photography device senses the light and generates first and second images corresponding to the pin of the first electronic component at different rotation angles. The adjustment device adjusts the photography device and the light-source device to a first height and a second height, wherein the first images correspond to the first height and the second images correspond to the second height. The image-processing device calculates first feature information of the pin of the first electronic component according the first and second images, and analyzes the state of the pin of the first electronic component according to the first feature information.

A grounding includes a photoelectric sensor that emits light to a detection region in which the detection target portion moves in conjunction with the grounding of the electronic component to a board and receives light from the detection region, and a grounding discrimination section that discriminates between the presence or absence of the grounding based on a signal from the photoelectric sensor. The detection target portion is disposed in the detection region in the ungrounded state.

A mounting system including a component mounting device configured to mount a component on a surface of a board, and a control device. The component mounting device includes an imaging device to image the surface of the board. The control device stores drawing information depicting the board surface on which the component is to be mounted by the component mounting device, compares a specific position in the stored drawing information with a specific position in image information of the board surface imaged by the imaging device, and recognizes that the planned mounting section of the board surface is not at the predetermined position when the specific position in the drawing information and the specific position in the image information are different.

In a component supply device, an opener is configured to move in a second direction with movement of a tape in the second direction when the tape is fed in the second direction opposite to a first direction in which the tape is fed from a tape feeder to the opener.

When performing inspection of a tip of a suction nozzle, the tip of the suction nozzle is imaged, and an opening of the tip of the suction nozzle is identified based on the image data. With the image based on the image data, locations with less than a set brightness level inside a location with the set brightness level and greater is identified as the opening. The identified opening is divided into four regions by boundary lines, and the area of the opening is calculated for each of the regions. Based on the areas calculated for each region, it is determined whether the suction nozzle is good. By determining whether the suction nozzle is good based on the area of the opening for each region, it is possible to reliably determine whether the suction nozzle is good.

A device for aligning and optically inspecting a semiconductor component arranged on a receiving tool that is arranged on a turning mechanism. The device aligns the semiconductor component in relation to a center of the receiving tool in at least one axis direction and/or a direction of rotation. The turning mechanism is designed to rotate about a turning axis and to move the semiconductor component out of a receiving position into an offset position, with two slides that can be moved towards and away from each other and comprise slide sections, the two slide sections coming to rest on two lateral surfaces of the semiconductor component, at least in sections, in order to align the semiconductor component arranged on the receiving tool, the slide being defined such that it slides and/or rotates the semiconductor component into an inspection position, while the receiving tool holds the semiconductor component.

A component mounting apparatus sets a position that is offset with respect to a suction reference position of a component toward the front side in a feeding direction as a suction position based on a difference between a dimension of the recess-shaped cavity in the Y-direction and a dimension of the component accommodated in the cavity in the Y-direction and sucks the component. Therefore, even if the component in the cavity positionally deviates toward the front side in the feeding direction due to inertia when a carrier tape is stopped, a suction nozzle sucks an appropriate position of the component.