Heights of components or parts thereof are measured within a printing machine by measuring their relative rather than absolute heights. A virtual surface may be constructed from the measured heights, with a tolerance level employed based on the virtual surface. The invention is particularly suited to measurement of tooling components within a printing machine, such as tooling pins.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.

A processing apparatus for an electronic component includes a component holder configured to hold the electronic component, a turning unit configured to hold the component holder toward an outside of a predetermined circular track, a turning drive unit configured to turn the turning unit around a first axis along a central axis of the circular track, and a rotation drive unit provided on the turning unit and configured to rotate the component holder around a second axis along a radial direction of the circular track.

A method and system for reducing influence of a remote reference power noise on signal quality are provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.

An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.

An apparatus and method for dissembling electronic devices are described. The apparatus includes a housing with an aperture providing access to an interior thereof, and an adjustable support assembly positioned therein. The support assembly includes a first side plate and a second side plate with spacing in between, and a base plate for supporting an electronic device. A user interface is provided for receiving a user input, and in response to the user input, a motor is configured to drive a ram member downwards to contact and apply force to the electronic device held in the support assembly. A sensor may be included to measure the motor load current and output the measured load to an indicator to be viewed by a user for determining when a shell of the electronic device has been cracked.

An analysis device is a device for use for a component mounting device including a pickup member configured to be moved relative to a board by means of a moving device and a contact detection sensor configured to detect that a component picked up by the pickup member is brought into contact with the board to analyze a mounting state of the component mounting device. The analysis device includes a storage device configured to store multiple detection result data relating to detection results obtained by the contact detection sensor when the component is mounted on the board in association with mounting conditions when the detection results are obtained by the contact detection sensor, and an output device configured to count the multiple detection result data stored in the storage device by at least two conditions in the mounting conditions and output the multiple detection result data so counted.

There is provided a component mounter that conveys in a board having a product area in which a pattern electrode incorporated in an electrical product is disposed and an inspection area in which an inspection electrode for inspecting electrical characteristics is disposed, and conveys out the board after repeatedly executing an operation of picking up a component supplied by a component feeder and installing the component in the product area according to an installation sequence program, the device including: target event occurrence detector for detecting occurrence of an event that requires inspection of the electrical characteristics with respect to the component supplied by the component feeder; a determiner for determining whether or not the inspection area is vacant; and inspection-required component installer for installing the component picked up from the component feeder in the inspection area as an inspection-required component, in a case where the target event occurrence detector detects the occurrence of the event and the determiner determines that the inspection area is vacant.

A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.