A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.

The feeder includes a first sprocket provided in an insertion section, having engagement protrusions, engageable with engagement holes of a carrier tape, formed on only a part of the outer circumference, and a second sprocket arranged side by side with the first sprocket, on the supply section side of the first sprocket, having engagement protrusions formed over the entire circumference. A control device of the feeder restricts contact between the engagement protrusions of the first sprocket facing the carrier tape and the carrier tape after the engagement protrusions of the second sprocket disengage from the carrier tape in an unloading process of conveying the carrier tape to the insertion section side.

A feeder includes a sprocket that feeds a tape accommodating multiple components; a motor that rotates the sprocket; a storage section to store the rotational position of the sprocket detected by a sensor as an initial rotational position when the tape is set in the feeder and store a cumulative feeding amount of the tape fed by the rotation of the sprocket; and a control section to control the motor such that the sprocket rotates in a forward direction based on a feeding amount of the tape required for a supply when supplying the components to the component mounting machine, and control the motor such that the sprocket does not rotate in a reverse direction in excess of the initial rotational position based on the initial rotational position and the cumulative feeding amount when rewinding the tape.

A method comprises obtaining a plurality of 2-dimensional gray scale images of a portion of a printed circuit board assembly. Each 2-dimensional gray scale image corresponds to one of a plurality of parallel planes intersecting the portion of the printed circuit board assembly at respective different locations. The method further comprises converting the plurality of 2-dimensional gray scale images into a color image. Each of the plurality of 2-dimensional gray scale images corresponds to and is used as input for a respective color channel of the color image. The method further comprises analyzing the color image to detect variation in color that indicates a defect; and outputting an alert indicating the defect in response to detecting the variation in color.

The present invention provides a component mounting machine (1) comprising a picking tool (2) for picking electronic components (3) from a source (4) of electronic components and placing them onto a workpiece (5), a verification unit (6) for measuring an electrical property of an electronic component (3) picked and held by the picking tool (2). The verification unit (6) comprises a board (7), a plurality of test electrodes (8) arranged on a surface (9) of said board (7) and a system (10) for measuring an output signal from the test electrodes (8) upon contact between a picked electronic component (3) and at least two of said test electrodes (8). Further, at least one test electrode (8) is arranged on a flexible portion (11) of the board (7) that is configured to flex upon engagement between a picked electronic component (3) and said at least two test electrodes (8).

A mounting apparatus includes a lifting and lowering device that lifts and lowers a holding member holding a component with respect to a substrate, a contact detection section that detects contact between the holding member or a component held by the holding member and the substrate, and a control section that sets a mounting height of the component in accordance with a height of the substrate, causes the holding member holding the component to be lowered to the mounting height by the lifting and lowering device, and releases holding of the component to mount the component when the contact is detected, in which the control section acquires a height of the holding member when the holding member is lowered by the lifting and lowering device and the contact is detected, and measures the height of the substrate based on the height of the holding member.

Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

There is described an electronic device testing system for testing an electronic device having a substrate on which is printed a metamaterial structure using an ink. The electronic device testing system generally has: a terahertz radiation emitter configured to emit an incident terahertz radiation beam to be incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; a terahertz radiation receiver configured to receive an outgoing terahertz radiation beam outgoing from the metamaterial structure and to measure an amplitude of an electric field of the outgoing terahertz radiation beam at least at the terahertz resonance frequency; and a controller configured to determine a conductivity value indicative of a conductivity of the ink based on said amplitude of the electric field of the outgoing terahertz radiation beam.

Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

During mounting of an upper component on a lower component, after mounting the lower component on a board, the Z-axis position of a suction nozzle tip is detected during mounting of the lower component on the board and memorized as a lower component height, and when mounting the upper component PU, the suction nozzle is lowered at relatively high speed until reaching a specified position that is a distance above the lower component height, and the suction nozzle is lowered at a speed that is slower than the speed after arriving at the specified position until contact with the lower component.