[Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate. [Means for Solution] A wiring substrate for electronic component inspection apparatus 1 which includes a first laminate 3 composed of a plurality of stacked resin layers j1 to j3 and having a plurality of pads for probe 9 on its front surface 5, a second laminate 4 disposed on a back surface 6 side of the first laminate 3 and composed of a plurality of stacked ceramic layers c1 to c3, and a plurality of studs 20a joined to a back surface 8 of the second laminate 4 and in which the resin layers j1 to j3 of the first laminate 3 are formed of a resin having a thermal deformation temperature of 300 C. or higher, and the studs 20a are joined to surfaces of metal layers 16 formed on the back surface 8 of the second laminate 4 via brazing material layers 28, respectively.

A nozzle management device includes a plurality of pallets, each of the pallets configured to house a plurality of nozzles; a pallet storage device configured to store the pallets; and a pallet moving device configured to move the pallets.

A component mounting machine which deals with a component remaining on a nozzle of a mounting head includes a board conveyance device conveying a board to a predetermined position, a component supply device accommodating multiple components therein, a component mounting device on which a mounting head which picks up and holds a component by vacuum pumping of a suction nozzle is installed and which mounts a component which is taken out from the component supply device onto a board which is conveyed by the board conveyance device, and a control device controlling each of the devices. The component mounting device performs lowering of the component, releasing the component with respect to the suction nozzle of the mounting head, a first lifting of the component to a middle height, a component pickup performed at the height of the first lifting, and a second lifting after the component pickup.

A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.

In an inspection device, components are separated and collected after electrical characteristics have been measured. The inspection device includes holding table, pair of measuring elements and configured to grip a component held on holding table and measure electrical characteristics of the component; and a relative movement device configured to relatively move holding table and the pair of measuring elements. The components are separated and collected by the relative position of movable element and holding table being changed based on measurement results of the electrical characteristics of the component.

Various back-drilled via probing techniques are described. In some cases, a screw may be utilized to establish a conductive pathway through a voided portion of a back-drilled via to a plated portion of the back-drilled via to enable back-drilled via probing. In other cases, a combination of solder paste and a wire may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a compliant pin that includes a metallized particle interconnect material may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a combination of an ultraviolet curable film and a light pipe may be utilized to establish a conductive pathway the conductive pathway to enable back-drilled via probing.

A component mounting machine which deals with a component remaining on a nozzle of a mounting head includes a board conveyance device conveying a board to a predetermined position, a component supply device accommodating multiple components therein, a component mounting device on which a mounting head which picks up and holds a component by vacuum pumping of a suction nozzle is installed and which mounts a component which is taken out from the component supply device onto a board which is conveyed by the board conveyance device, and a control device controlling each of the devices. The component mounting device performs lowering of the component, releasing the component with respect to the suction nozzle of the mounting head, a first lifting of the component to a middle height, a component pickup performed at the height of the first lifting, and a second lifting after the component pickup.

A system for tracking objects such as a printed circuit board (PCB) undergoing multiple manufacturing processes traceability system includes a coding unit, a scanning unit, and a reading unit and a database. The printed circuit board includes at least two inner copper foil substrates, subsequent substrates can be added. The coding unit marks identification and manufacturing stage codes on the inner copper foil substrate for through scanning by the scanning unit emitting X-rays. The reading unit can receive and parse the codes identified by the X-rays, and determine the previous or a next stage according to a predetermined encoding rule without risk of stage repetition or stage omission or product misplacement. The database stores standard identities and information as to manufacturing stages as a reference.

Based on the measured values of the electrical characteristics of multiple components including a component positioned in the middle among many components held on the component tape, it is possible to more accurately estimate the electrical characteristics of the many components as compared with the case based on the measured value of the electrical characteristic of a component positioned at the leading end. Also, based on the statistically processed results of these measurement values, it is possible to appropriately evaluate the electrical characteristics of many components. Further, if the electrical characteristics of all of the components are measured, the evaluation can be performed more appropriately.