A work device analysis method includes acquiring work history information from a work device, the work device being attached with a work unit that performs a work for manufacturing an electronic circuit board (ST1), generating a first file and a second file from the work history information acquired, the first file including an operation event log of the work device, the second file including a manufacturing log of the electronic circuit board (ST2 to ST4), determining maintenance necessity of the work unit based on the first file (ST5), and estimating a state of the work unit based on the second file (ST6).

The apparatus according to various embodiments includes one or more processors, and one or more memories operatively connected to the one or more processors. The one or more memories may store instructions that, when executed, cause the one or more processors to acquire a plurality of first position offsets of a plurality of first components respectively mounted on a plurality of first substrates with respect to a plurality of pads of the plurality of first substrates corresponding to the plurality of first components from the optical measurement device, set a range of a normal state for a component position offset based on the plurality of first position offsets, generate a control signal for adjusting at least one control parameter of the component mounting device associated with a component mounting position based on the range of the normal state, and transmit the control signal to the component mounting device.

A component mounting includes an external monitoring camera that images an outside work area that is an area outside of the component mounting machine at which an operator performs work with respect to the component mounting machine. The outside work area of the component mounting machine includes at least an area where a feeder is set, and a monitoring target is at least a state during and after completion of setting the feeder on the component mounting machine and during and after completion of setting component supply tape on the feeder. By looking at a recorded image or a real time image displayed on a display device by using the external monitoring camera to capture an outside work area of the component mounting machine, it is possible to check the state of the monitoring target on which an operator performed work in the outside work area of the component mounter.

An information management device for managing information in a mounting system that mounts a component after determining usability of the component when the component is picked up from a wafer divided into multiple components and is mounted on a base material, includes an information storage section that stores various types of information, an information acquisition section that acquires information on a pickup position of the component on the wafer and information on a determination result of usability of the component, and an information processing section that stores information obtained by associating the pickup position of the component with the determination result of the usability in the information storage section.

A mounting device of the present disclosure is used in a mounting system including multiple mounting devices that perform a mounting process on a mounting target. The mounting device includes a mounting section configured to pick up a component from a supply section holding the component and perform the mounting process for the component on the mounting target, an inspection section configured to perform an inspection process on the component disposed on the mounting target by using reference information, and a control section configured to, when the reference information is updated after an error in the component subjected to a mounting process prior to the mounting device is detected, cause the inspection section to execute the inspection process using the updated reference information on the component subjected to the mounting process prior to the mounting device.

A board work machine includes a backup plate, a backup member disposed on the backup plate to support a board from below, a movement device configured to move the backup member, a movement control section configured to control an operation of the movement device based on a position program indicating a position of the backup member disposed on the backup plate, a display section configured to display the position of the backup member indicated by the position program in a superimposed manner on a board image indicating the board, and an editing section configured to edit the position program in response to a request for increasing or decreasing the number of the backup members and changing the position of the backup member from an operator.

A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed.

A component mounting machine includes a component supply device, a head having a nozzle, and a control device configured to control each device. The control device is configured to control a cameras to image a component, determine the normality and abnormality of an operation executed immediately before a current imaging timing based on an image captured at the current imaging timing, classify the image captured at the current imaging timing as a normal image in a case in which a result of determination of the normality and abnormality is made as normal, and classify the image captured at the current imaging timing and a part or all of images captured at imaging timings prior to the current imaging timing as an abnormal image in a case in which the result of the determination of the normality and abnormality is made as abnormal.

A component mounter includes a mounting tool to receive the electronic component in a component supply position and release the electronic component at a predetermined position on the board; an accommodation section accommodating mounting tools of multiple types; a head configured to detachably mount thereon a single mounting tool selected from the mounting tools of the multiple types in the accommodation section; a moving mechanism to move the head between the component supply position and the predetermined position on the board; an abnormality detecting section to detect an abnormality in relation to the mounting tool; and a selection section to select the mounting tool to be mounted on the head, and select a mounting tool of a second type, which differs from the mounting tool of a first type which is being mounted on the head, when the abnormality is detected by the abnormality detecting section.

A component mounting system includes a component mounting device including a component mounting unit configured to mount a component on a substrate, and a controller, and a server configured to be communicable with the controller. The controller is configured or programmed to acquire a plurality of types of operating state changes that are likely to cause a quality defect, and to transmit, to the server, information according to the types of the operating state changes. The server is configured to provide information indicating an inspection type for the substrate based on the information according to the types of the operating state changes.