An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.

A method for determining a cause of a mounting failure for a component mounted on a substrate, which is performed by an electronic apparatus, comprises: receiving an inspection result of a mounting failure for each of a plurality of first components determined by inspecting a plurality of substrates of a first type; calculating a mounting failure rate of each of the plurality of first components using the inspection result; determining a plurality of second components in which a mounting failure has occurred based on the mounting failure rate; and determining a cause of the mounting failure for each of the plurality of second components as at least one of a component mounting position setting error, a mounting condition setting error according to a component type and a defect of a nozzle, based on the mounting failure rate of each of the plurality of first components.

A tracing device includes an appropriateness determination section configured to determine whether an image processing, which is executed in a production process of a board product by a board work machine, satisfies an appropriateness condition indicating reliability of a result of the image processing when the result of the image processing stays within a permissible range in which the result of the image processing is determined normal and an information management section configured to record image data used in the image processing as traceability information according to the result of the determination made by the appropriateness condition determination section.

A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.

In a component-mounted-board production line in which an automatic exchanging device moves along a row of multiple component mounters, each component mounter is provided with a power supplying section that supplies power wirelessly. The automatic exchanging device is provided with a power receiving section that receives electric power supplied wirelessly from the power supplying section of the component mounter that the automatic exchanging device is facing, a monitoring section that monitors whether a person or object has entered a monitoring area around the automatic exchanging device, and a safety circuit section that turns off the power supply to a motor that is the driving source of the automatic exchanging device but continues supplying power to the monitoring section and the like when the monitoring section detects that a person or object has entered the monitoring area.

There is provided a component mounting machine in which when detecting a lowermost end position of a component sucked by a suction nozzle, a lower edge position of the component is detected at predetermined intervals from a left side and a right side using the lowermost end position as a reference. The component mounting machine derives an approximate straight line obtained by approximating multiple lower edge positions detected from the side having a larger detection number and the lowermost end position and an angle of the approximate straight line is detected as the suction angle of the component. Accordingly, the component mounting machine can appropriately detect the suction angle of the component with a simple process and correctly determine the suction posture of the component.

A constitutive device quality determination server is communicably connected to an inspection device via the internet, the inspection device performing an inspection on a constitutive device configuring a board work machine by operating the constitutive device in accordance with to a type of the inspection, and includes an inspection data acquisition section that designates a predetermined type of the inspection for the inspection device and acquires inspection data obtained by the inspection by the inspection device, a determination section that determines quality of the constitutive device based on the acquired inspection data, and a transmission section that transmits a quality determination result determined by the determination section to a terminal device communicably connected over the internet.

A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven. Then, based on determining that the measured temperatures of the temperature sensitive components exceeds the temperature limits, the computer determines an elapsed time outside of the temperature limit when the measured temperatures of the temperature sensitive components exceeds the temperature limits.

Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

A method includes a component mounting step of mounting components on a board; a positional deviation amount acquisition step of acquiring a positional deviation amount of each of the components mounted on the board, from a corresponding normal position; and a correction value calculation step of calculating a feedback correction value for correcting a mounting operation in the component mounting step, based on the acquired positional deviation amount. In the correction value calculation step, the feedback correction value is calculated based on the positional deviation amount of each of the components mounted in each of a plurality of division areas on the board, for each of the plurality of division areas, and in the component mounting step, the mounting operation is corrected by using the feedback correction value of the plurality of division areas in which the components are mounted.