A setup support device that improves the efficiency of setup of a component mounter by guiding supplying of feeders to a component supply device as preparation for setting of the feeders. The support setup device includes: a preparation cart on which are loaded multiple of the feeders used to perform multiple production jobs; and a feeder identifying section configured to identify multiple of the feeders to be set on a component supply device among the multiple feeders loaded on the preparation cart. The preparation cart includes a guidance section configured to issue guidance all at once for the identified multiple feeders to an operator performing the setup so as to supply the identified multiple feeders to the component supply device as preparation for setting the identified multiple feeders on the component supply device.

Provided is a manufacturing apparatus that manufactures a high-quality manufacturing object by using component information per unit of individual electronic component or per unit of package in a plurality of electronic components that have been packaged. The manufacturing apparatus is a manufacturing apparatus that manufactures a product by taking out each electronic component from packaged components in which a plurality of electronic components are packaged. The manufacturing apparatus is provided with: a component information reading unit that reads component information per unit of electronic component or per unit of package in the packaged components; a manufacturing control unit that controls, using the read component information, the manufacturing treatment of product into which electronic components indicated in the component information are incorporated; and an incorporation information generating unit that generates incorporation information regarding a state of incorporation of each electronic component in the product.

A component mounting method used in a system with a plurality of component mounting apparatuses includes reading out a substrate ID of a substrate and detecting whether the substrate is in a state of being able to be inserted or removed from one of the component mounting apparatuses. If the substrate is not in a state of being able to be inserted or removed, the substrate ID of the substrate is delivered by an upstream component mounting apparatus. If the substrate is in a state of being able to be inserted or removed the substrate ID is read in a downstream component mounting apparatus.

An electronic component mounting method for mounting a first board and a second board including, mounting a first set of electronic components on the first board allocated to first mounting heads; and mounting a second set of electronic components on the second board allocated to the second mounting heads and to the first mounting heads and the second mounting heads of the second lane dedicated mounters. By this, the mounting load is spread evenly across all the mounting heads, thus the idle time of mounting heads is reduced, improving the operating rate, meaning that panels are produced efficiently by the electronic component mounting method.

A substrate work system including an information management device to manage traceability information of configuration items that configure a circuit board product; an imaging device to image an identification code attached to the configuration item; and an imaging control device to read the identification code imaged by the imaging device, and transmit a serial number recorded in the identification code to the information management device. The imaging control device includes a compatibility conditions setting section to set compatibility conditions that the identification code attached to the configuration item should satisfy, or compatibility conditions that the serial number recorded in the identification code should satisfy, a compatibility conditions determining section configured to determine whether the imaged identification code or the serial number recorded on the imaged identification code satisfies the compatibility conditions, and a transmitting section transmit the serial number to the information management device.

It is an object of the present invention to provide a production system and a control method for the production system that can suppress erroneous mounting when a tape feeder is shared and used even when latest tape feeder information is not shared among multiple production lines in a production system having multiple production lines. Information that matches the tape feeder database stored by the line management device is stored in the tape feeder. When the tape feeder is mounted on the mounting machine, the information stored in the tape feeder is read, and when it is determined that the information does not match the tape feeder database, mounting of the electronic component supplied from the tape feeder is stopped.

A component mounting system has a supply reel accommodating a component, a plurality of mounting lines each having a mounting apparatus and a line management apparatus, and a central network that provides direct communication between the line management apparatuses of each mounting line. A remaining number of components on the supply reel is determined based on cross line communication between the line management apparatuses and comparison of data at different times stored on the line management apparatuses. Such architecture does not require the use of a central server. Rather, the system is a material information exchange system without a single point of failure, where no one computer failure can cause an entire factory shutdown.

A system for tracking objects such as a printed circuit board (PCB) undergoing multiple manufacturing processes traceability system includes a coding unit, a scanning unit, and a reading unit and a database. The printed circuit board includes at least two inner copper foil substrates, subsequent substrates can be added. The coding unit marks identification and manufacturing stage codes on the inner copper foil substrate for through scanning by the scanning unit emitting X-rays. The reading unit can receive and parse the codes identified by the X-rays, and determine the previous or a next stage according to a predetermined encoding rule without risk of stage repetition or stage omission or product misplacement. The database stores standard identities and information as to manufacturing stages as a reference.

There is a provided a label feeder for a hybrid irregular component insertion robot, the label feeder includes: a label printer configured to print a label to be attached to a printed circuit board or an electronic component supplied from an electronic component supply unit to a hybrid irregular component insertion robot, and to enable the printed label to be published; and a label supply unit configured to take over the label being published from the label printer and supply the label to a label pickup position provided inside the hybrid irregular component insertion robot.

A die component supply device includes a wafer holding section; a suction nozzle configured to pick up the die components one by one from the component holding sheet; an imaging camera configured to image the die component, which is a pickup target of the suction nozzle, together with the surrounding condition, before being picked up to obtain component image data; a driving section configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data.