A component mounting system includes a component mounting line, a storage device, and a display device. The component mounting line is formed by connecting a plurality of mounting board manufacturing machines. The storage device is connected to the component mounting line via a network to acquire information from each of the plurality of mounting board manufacturing machines. The display device is connected to the storage device via the network and displays a progress status of set-up work executed when changing a type of a mounting board manufactured by the component mounting line based on information stored in the storage device.

An automatic conveyance apparatus includes a first loading surface, an adjustment device, a movement device, and a control section. The control section drives the movement device to move the member between the first loading surface and the second loading surface when the automatic conveyance apparatus is positioned at a member delivery position and/or a member pickup position where the automatic conveyance apparatus delivers and/or picks up the member and when the height and the inclination of the first loading surface are adjusted in accordance with the height position and the inclination position of the second loading surface by the adjustment device. The automatic conveyance apparatus is configured to travel between multiple predetermined positions including the member delivery position and/or the member pickup position.

To manufacture a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using touch down sensors, a pick-up head including touch down sensors and the semiconductor devices on the carrier substrate are moved relative to each other to contact the carrier substrate with the touch down sensors. Signals from each touch down sensor indicating a degree of deformation of each touch down sensor caused by the contact with the carrier substrate are used to determine an orientation of the pick-up head by processing the signals, and adjust the orientation of the pick-up head based on the determined orientation to attach the semiconductor devices onto the pick-up head. In some embodiments, the touch down sensors are piezoelectric benders.

A device management apparatus includes a board working machine and a management section. The board working machine includes a first slot and a second slot, and performs a predetermined board work on a board to produce a board product. The first slot can hold a device used in the production of the board product. The second slot can preliminarily hold the device that is scheduled to be used in the production of the board product or can temporarily hold the device that has become unnecessary in the production of the board product. The management section updates a control program for controlling the device of a target device requiring update of the control program in the second slot.

A manufacturing system according to the present disclosure includes one or more manufacturing apparatuses, a carrier, and a control system. Each of the one or more manufacturing apparatuses performs predetermined work on a board. The carrier carries a burden. The control system controls carrying work by the carrier. The burden includes a plurality of functional modules. Each of the plurality of functional modules provides a predetermined function for the one or more manufacturing apparatuses. The carrier includes a coupling portion to be coupled to any of the plurality of functional modules. The control system has at least one functional module, selected from the plurality of functional modules and coupled to the coupling portion, carried by the carrier.

A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.

An information processing device of the present disclosure is used in a mounting system including multiple mounting-related devices each having a display section that visually notifies an operator of information and an attachment portion to which a member is attached and related to a process of mounting a component on a processing target object, and a moving work device that is moved between the multiple mounting-related devices to automatically attach and detach the member to and from the attachment portion. The information processing device includes a control section that outputs, to the display section, notification information including work details that are substitutable by the operator in association with a status of the moving work device based on a predetermined priority order based on continuation of processes of the mounting-related devices.

In a case where a target feeder to be used in a target job is pre-served, a management device determines whether a predetermined slot of the target feeder overlaps with a predetermined slot of a feeder to be used in a preceding job executed prior to the target job. When predetermined slots of both feeders do not overlap with each other, the management device pre-serves the target feeder in the predetermined slot of the target feeder. On the other hand, when the predetermined slots of both feeders overlap with each other, the management device serves the target feeder to the predetermined slot of the target feeder after an execution of a preceding job which uses a feeder of which a predetermined slot overlaps with the predetermined slot of the target feeder is completed.

A component mounting system includes an execution procedure determination section for determining an execution procedure of multiple mounting jobs, and a job switching section for switching the mounting jobs. The job switching section holds, in the attachment target section, a feeder accommodating a component common to a component used in the subsequent mounting job among components used in the previous mounting job when the previous and subsequent successive mounting jobs in the execution procedure are switched, and mounts, on an empty attachment target section among the multiple attachment target sections, a feeder accommodating a component not common to a component used in the previous mounting job among components used in the subsequent mounting job.

An electronic component mounting machine including a board clamp device configured to clamp a circuit board conveyed by a conveyor by sandwiching side edge sections of the circuit board between a clamp member from below and a conveyor rail from above by raising the clamp member, the electronic component mounting machine being configured to mount electronic components on the circuit board clamped by the board clamp device; and a control device configured to control a clamping force that is a sandwiching force on the side edge sections of the circuit board sandwiched between the clamp member and the conveyor rail of the board clamp device. The control device is configured to acquire board information including at least a weight of the circuit board and to control the clamping force of the board clamp device based on the acquired board information.