An electronic component mounting machine includes a storage section configured to store viscous fluid, a head section configured to hold an electronic component having a bump and to immerse the bump of the electronic component in the viscous fluid, an irradiation section configured to irradiate the bump, to which the viscous fluid has been transferred, with light, an imaging section configured to capture an image of the bump irradiated with light from the irradiation section, and a control device. The control device executes detection processing for detecting a transfer amount of the viscous fluid transferred to the bump based on image data captured by the imaging section, determination processing for determining whether the transfer amount is good or bad, and transfer processing for transferring the viscous fluid to the bump in accordance with the transfer amount being less than a predetermined threshold.

The feeder includes a first sprocket provided in an insertion section, having engagement protrusions, engageable with engagement holes of a carrier tape, formed on only a part of the outer circumference, and a second sprocket arranged side by side with the first sprocket, on the supply section side of the first sprocket, having engagement protrusions formed over the entire circumference. A control device of the feeder restricts contact between the engagement protrusions of the first sprocket facing the carrier tape and the carrier tape after the engagement protrusions of the second sprocket disengage from the carrier tape in an unloading process of conveying the carrier tape to the insertion section side.

An automatic conveyance apparatus includes a first loading surface, an adjustment device, a movement device, and a control section. The control section drives the movement device to move the member between the first loading surface and the second loading surface when the automatic conveyance apparatus is positioned at a member delivery position and/or a member pickup position where the automatic conveyance apparatus delivers and/or picks up the member and when the height and the inclination of the first loading surface are adjusted in accordance with the height position and the inclination position of the second loading surface by the adjustment device. The automatic conveyance apparatus is configured to travel between multiple predetermined positions including the member delivery position and/or the member pickup position.

An automatic backup pin arrangement operation includes a backup plate facing a lower surface of circuit board where backup pins stored in a stock areas are picked up with an XY-robot to be automatically arranged at positions of the backup plate designated in a production job. In a case where there is no free space in the stock areas for an unnecessary backup pin removed from the backup plate to be placed when a production job for changing the arrangement of the backup pins is switched, at least a part of a region of the backup plate facing a lower surface of the circuit board, which does not interfere with a mounted component on a lower surface side of the circuit board, is used as retraction area, and the unnecessary backup pin that cannot be retracted to the stock area is retracted to the retraction area.

A control device is used for a mounting device with a mounting head including at least a first holder on which a first pickup member is installed, and a second holder on which a second pickup member is installed, and configured to pick up components supplied from a component supply section and mount the components. The control device includes a control section configured to acquire a first deviation amount of a tip of the first pickup member and a second deviation amount of a tip of the second pickup member and select a combination of the pickup members in which an interval between the tips of the pickup members that is obtained based on the first deviation amount and the second deviation amount falls within a predetermined range.

A board work system including: a conveying and holding device including a pair of rails configured to support a board, and a changing mechanism configured to change a distance between the pair of rails, the conveying and holding device being configured to convey the board supported by the rails and hold the board at a work position; a work device configured to perform work with respect to the board held by the conveying and holding device from an underside of the board; a moving device configured to move the work device; and a control device, the control device including an acquiring section configured to acquire a rail spacing distance that is the distance between the pair of rails, and an operation control section configured to control operation of the moving device based on the rail spacing distance acquired by the acquiring section.

A component mounting system includes a component mounting device including a component mounting unit configured to mount a component on a substrate, and a controller, and a server configured to be communicable with the controller. The controller is configured or programmed to acquire a plurality of types of operating state changes that are likely to cause a quality defect, and to transmit, to the server, information according to the types of the operating state changes. The server is configured to provide information indicating an inspection type for the substrate based on the information according to the types of the operating state changes.

An information processing device is used in a mounting system that performs processing of mounting a component on a mounting target. The information processing device includes: a memory section configured to store multiple pieces of abutting part data including a shape of an abutting part that abuts against the component, multiple pieces of attachment part data including a shape of an attachment part to be attached to an attachment section to which a collection member for collecting the component is attached, and multiple pieces of connection part data including a shape of a connection part that connects the abutting part and the attachment part, in the collection member; and a control section configured to output one or more of the abutting part data, the attachment part data, and the connection part data stored in the memory section.

A mounting device includes a mounting section configured to pick up a component from a supply section that holds the component and execute a mounting process of the component on a mounting target, and a control section configured to acquire an inspection result obtained by executing an inspection process on the components placed on the mounting target and to notify an operator of the inspection result indicating that the component is defective at a timing before mounting an inspection resulted mounting component that is turned out to be mountable after the inspection result is determined.

An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.