A mounting head maintenance device includes an external flow path to communicate with an internal flow path of a mounting head, the mounting head having a nozzle holding section that detachably holds a suction nozzle, the internal flow path that selectively supplies negative pressure air and positive pressure air to the held suction nozzle, and an internal air sensor that is provided in the internal flow path and detects at least one of a flow rate and pressure of the air, a reference air sensor in the external flow path and configured to detect at least one of the flow rate and the pressure of the air, and a detection result acquiring section to acquire an internal detection result of the internal air sensor and a reference detection result of the reference air sensor which can be compared with the internal detection result in association with each other.

A manufacturing system according to the present disclosure includes one or more manufacturing apparatuses, a carrier, and a control system. Each of the one or more manufacturing apparatuses performs predetermined work on a board. The carrier carries a burden. The control system controls carrying work by the carrier. The burden includes a plurality of functional modules. Each of the plurality of functional modules provides a predetermined function for the one or more manufacturing apparatuses. The carrier includes a coupling portion to be coupled to any of the plurality of functional modules. The control system has at least one functional module, selected from the plurality of functional modules and coupled to the coupling portion, carried by the carrier.

A work device analysis method includes acquiring work history information from a work device, the work device being attached with a work unit that performs a work for manufacturing an electronic circuit board (ST1), generating a first file and a second file from the work history information acquired, the first file including an operation event log of the work device, the second file including a manufacturing log of the electronic circuit board (ST2 to ST4), determining maintenance necessity of the work unit based on the first file (ST5), and estimating a state of the work unit based on the second file (ST6).

A substrate work system including a work device configured to perform predetermined work on a substrate by use of an exchangeable work unit includes a storage section configured to store the work unit, a maintenance device configured to perform maintenance of the work unit, a conveyance device capable of conveying the work unit, a determination section configured to determine a maintenance time for the work unit used in the work device based on quality information on work quality of the predetermined work, and a control section configured to, when the determination section determines that a maintenance time arrives, cause the conveyance device, the work device, and the maintenance device to unload the work unit, convey the work unit to the work device to exchange with the work unit that has been used, and convey the used-up work unit to the maintenance device.

A component mounting system includes a component mounting device including a component mounting unit configured to mount a component on a substrate, and a controller, and a server configured to be communicable with the controller. The controller is configured or programmed to acquire a plurality of types of operating state changes that are likely to cause a quality defect, and to transmit, to the server, information according to the types of the operating state changes. The server is configured to provide information indicating an inspection type for the substrate based on the information according to the types of the operating state changes.

The disclosed system generally comprises a damping module, a pressing module, a placement platform for placement of the multiple stacked planar objects and a compensatory mechanism engaging to the damping module. Particularly, the damping module includes a damper, a resilient component and an elongate support which are all arranged within a holder. Each of the stacked planar objects has a top planar surface and an underside planar surface as well as carries a plurality of corresponding holes, which become aligned accordingly to form a plurality of longitudinal grooves upon placement onto the platform. The head portion of the damper is substantially aligning with the positioned groove and abutting onto the underside surface of the bottommost stacked object. The compensatory mechanism is capable of adaptively adjusting position of the head portion of the damper in relation to the pressing ram at the vertical and/or horizontal plane.

A mounting head is configured to be detachably attached to a mounting device main body. This mounting head includes a storage section having multiple storage areas, and a storage control section configured to acquire multiple operation data relating to an operation of the mounting head individually at different timings and store the multiple operation data individually in the multiple storage areas in such a state that the mounting head is attached to the mounting device main body.

A management device for managing a component mounter that mounts components onto a substrate using some of constituent elements each selected from one of constituent element groups each including the constituent elements. One group is a nozzle group including nozzles. The device includes: a true displacement amount calculator that calculates, for each target component which is the component, a true amount of displacement which is a sum of (i) an amount of pickup displacement being an amount of displacement between the target component and a target nozzle being one of the nozzles and picks up the target component and (ii) an amount of correction being an amount of offset of a position of the target nozzle when picking up the target component; and a statistical processor that performs parameter estimation for a predetermined statistical model using the true amount to calculate a degree of malfunction of each constituent element.

A pick and place nozzle performance analytics system streams production data from pick and place machines used in electronic assembly to a cloud platform as torrential data streams, and performs analytics on the production data to track, visualize, and predict performance of individual nozzles in terms of rejects or miss-picks. The analytics system generates a performance vector for each nozzle based on the collected production data, the performance vector tracking both the accumulated rejects and the percentage of rejects as respective dimensions of an x-y plane. The system monitors and analyzes the trajectory of this vector in the x-y plane to predict when performance degradation of the nozzle will reach a critical threshold. In response to predicting that nozzle performance degradation will exceed a threshold at a future time, the system can generate and deliver notifications to appropriate client devices.

A system including: an automatic exchanging device configured to move along the multiple component mounters arranged in a line and automatically exchange automatically exchangeable units of the component mounters; an operation monitoring device configured to monitor an operation state of the automatically exchangeable units of the component mounters and monitor whether it is necessary to exchange the automatically exchangeable units due to maintenance or a breakdown; and a management device configured to, when the operation monitoring device determines that exchange of one of the automatically exchangeable units of the component mounters is necessary due to maintenance or a breakdown, move the automatic exchanging device to the component mounter in question and cause the automatic exchanging device to perform automatic exchange of the automatically exchangeable unit of the component mounter with an exchange-use unit.