A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

This present disclosure generally relates to systems and methods of electrophoretic deposition (EPD) techniques for use in insulation systems at least partially encapsulating a semiconductor device, a conductive component and a substrate, such as insulation systems of semiconductor devices, busbars, or the like. Insulation systems formed using EPD processes may be designed to have a dielectric constant that decreases in a direction away from a substrate of the insulation system. This may improve insulation technologies since depositing coatings with sequentially arranged dielectric constants may improve resistance of the insulation system to high temperature, high electric fields, or the like.

To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280 C. and at most 320 C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 m.

An electronic device includes a substrate and one or more electronic components positioned on the substrate. A surface layer is positioned on the electronic components, the surface layer comprising a polymer binder and a substituted or unsubstituted hexahydrotriazine compound.

Disclosed is a flexible ultrasonic transducer in which a single layer serves dual function as both a matching layer and a flexible circuit for making electrical connections, and there is no separate matching layer. Also disclosed is a method of assembling the flexible transducer.

In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located on the encircled surface. When a shielding layer is provided to cover an encapsulating body located on the circuit layer, a space of the notch is not covered by the shielding layer such that a portion to be removed of the shielding layer will not remain on the electronic package to become burr after removing the portion to be removed.

A disclosed circuit arrangement includes an adhesive layer on a water soluble backing, antenna wire adhered to the adhesive layer, an RF transponder disposed on the adhesive layer, and first and second cross wires attached to the adhesive layer and disposed proximate the RF transponder. The antenna wire has first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire. The first and second cross wires and the antenna wire have round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the RF transponder and to the first portion of the antenna wire, and a second bond wire is connected to the RF transponder and to the second portion of the antenna wire.

According to one embodiment, a method of forming a metal foam with substantially uniform density includes forming a metallopolymer network including metallopolymer material with pre-defined ionic conductivity and pre-defined polymeric chain length, adding a reductant to the metallopolymer network during formation thereof for creating metal nanoparticles in the metallopolymer network, where the metal nanoparticles have substantially uniform size, and heating the reduced metallopolymer network for sintering the metal nanoparticles into a network.

To prevent degradation of electrical characteristics caused by a resin filled between electrodes in an ultraviolet light-emitting operation, the present invention provides a base 10 that comprises an insulating base material 11 and two or more metal films 12 and 13 that are formed on one side of the insulating base material 11 and electrically separated from each other. The two or more metal films are formed to include an upper surface and a side wall surface that are covered by gold or a platinum group metal, to be capable of mounting thereon one or more nitride semiconductor light-emitting elements and the like, and to have, as a whole, a predetermined planar view shape including two or more electrode pads. On the one side of the base material 11, along a boundary line between an exposed surface of the base material 11 that is not covered by the metal film 12, 13 and a side wall surface of the metal film 12, 13, at least a first part of the exposed surface of the base material 11 continuous with the boundary line that is sandwiched between two adjacent electrode pads and the side wall surfaces of the metal films 12 and 13 that oppose to each other with the first part interposed therebetween are covered by a fluororesin film 16, and a part of an upper surface of the metal film 12, 13 that composes at least the electrode pad is not covered by the fluororesin film 16.

A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 1010.sup.6/ C. to 1610.sup.6/ C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.