The present invention concerns a backplane electronic board (20) having on inner face (142) suitable for being connected to electronic board connectors (12) and an outer face (143) suitable for being connected to an outer connector (15), the backplane board (20) being characterized in that it has blind holes opening on the inner face (142) of same, and holes opening on the outer face (143) of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.

An electronic device includes a substrate and one or more electronic components positioned on the substrate. A surface layer is positioned on the electronic components, the surface layer comprising a polymer binder and a substituted or unsubstituted hexahydrotriazine compound.

The invention relates to a laser printing method that includes the following steps: (a) the provision of a receiver substrate (4); (b) the provision of a target substrate (5) comprising a transparent substrate (50) one surface of which has a coating has a coating (51) constituted of a solid metal film; (c) the localized irradiation of the said film (51) through the said transparent substrate (50) by means of a first laser (6) in order to reach the melting temperature of the metal in a target zone of the said film which is in liquid form; (d) the irradiation of the said liquid film through the said transparent substrate by means of a second laser on the said target zone defined in the step (c), in order to form a liquid jet in the said target zone and bring about the ejection thereof from the substrate in the form of molten metal; (e) the depositing on the receiver substrate of a molten metal drop over a defined receiving zone, with the said drop solidifying upon cooling.

A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

Provided is a circuit board and an electronic device thereof. The circuit board includes: a substrate; an insulating ink layer disposed on the substrate; a component disposed on a side of the insulating ink layer facing away from the substrate, where the component is electrically connected to the substrate through a window opening area on the substrate; and an encapsulation layer disposed on a side of the component facing away from the substrate. The insulating ink layer includes a first hydrochromic material, and in a case where humidity exceeds a first humidity threshold, the first hydrochromic material changes from a first color to a second color.

A resin composition contains a polyfunctional vinyl aromatic copolymer (A) containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, a curing agent (B), at least one filler (C) selected from the group consisting of a titanate compound filler (C1) and a magnesium oxide filler (C2), and a silica filler (D), in which the content ratio of the high dielectric constant filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.

Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O.sub.2, N.sub.2O, NO.sub.2, H.sub.2, NH.sub.3, N.sub.2, SiF.sub.4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiO.sub.xH.sub.yC.sub.zF.sub.aN.sub.b. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

A resin substrate with a transparent electrode having a low resistance, and a manufacturing method thereof including: a deposition step wherein a transparent electrode layer of indium tin oxide is formed on a transparent film substrate by a sputtering method, and a crystallization step wherein the transparent electrode layer is crystallized. In the deposition step, a sputtering deposition is performed using a sputtering target containing indium oxide and tin oxide, while a sputtering gas containing argon and oxygen is introduced into a chamber. It is preferable that an effective exhaust rate S, calculated from a rate Q of the sputtering gas introduced into the chamber and a pressure P in the chamber by a formula S (L/second)=1.688Q (sccm)/P (Pa), is 1,200-5,000 (L/second). It is also preferable that a resistivity of the transparent electrode layer is less than 310.sup.4 cm.