A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.

An epoxy resin composition for electronic material, containing a polyfunctional biphenyl type epoxy resin that is a triglycidyloxybiphenyl or a tetraglycidyloxybiphenyl and at least one of a curing agent and a curing accelerator is provided. Furthermore, the epoxy resin composition for electronic material, further containing a filler, in particular, a thermal conductive filler, is provided. Furthermore, a cured product obtained by curing the epoxy resin composition for electronic material, and an electronic component containing the cured product are provided.

A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.

An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O.sub.2, N.sub.2O, NO.sub.2, H.sub.2, NH.sub.3, N.sub.2, SiF.sub.4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiO.sub.xH.sub.yC.sub.zF.sub.aN.sub.b. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

Disclosed is a printed circuit board, to which at least one circuit device is mountable, including a base layer with a plurality of paper layers; a waterproof insulation layer laid on a first surface of the base layer; a copper foil layer laid on a second surface opposite to the first surface of the base layer and printed with a signal line pattern connectable with the at least one circuit device; and an adhesive layer configured to be interposed between the base layer and the copper foil layer that includes an adhesive material for adhering the base layer and the copper foil layer.

A circuit carrier for at least one electrical component, including: a metal substrate layer, a first electrical insulation layer arranged on the metal substrate layer, a second electrical insulation layer arranged on the first insulation layer, and an electrically conductive layer, arranged on the second electrical insulation layer, having at least one conductor track for electrically connecting the at least one electrical component, wherein at least one of the two electrical insulation layers is colored in such a way that the two electrical insulation layers have different colors.

An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally 02, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located on the encircled surface. When a shielding layer is provided to cover an encapsulating body located on the circuit layer, a space of the notch is not covered by the shielding layer such that a portion to be removed of the shielding layer will not remain on the electronic package to become burr after removing the portion to be removed.

A mainboard includes at least one power supply module and a mainboard body. The power supply module is arranged on the mainboard body. The power supply module comprises at least one surface-mounted element, a carrier plate, and an insulating layer. The carrier plate is provided with a first surface and a second surface which are opposite to each other, and the surface-mounted element is arranged on the first surface and the second surface. The insulating layer is formed in a chemical vapor deposition mode; a gap is formed between the surface-mounted element and the carrier plate, the gap is not completely filled with the insulating layer, and the insulating layer is further at least partially arranged on the surface of the space where the gap is located.